Screening of silicon wafers used in photovoltaics

1. A method of screening a wafer, which comprises:

presenting a plurality of wafers for illumination, wherein the plurality of wafers contain a first set of wafers that are suitable for use in subsequent deposition steps and a second set of wafers that are unsuited for use in subsequent deposition steps by virtue of cracking;

illuminating the plurality of wafers with a light source that imparts a predetermined thermal stress to the plurality of wafers such that the wafers in the second set of wafers incur substantial breakage determined as a percentage of broken wafers in the second set of wafers and the wafers in the first set of wafers do not incur substantial breakage determined as a percentage broken wafers in the second set of wafers; and

as a result of the illuminating step, selectively breaking the wafers of the second set of wafers.

2. The method of claim 1 wherein the step of illuminating proceeds while the wafer resides on a conveyor belt.

3. The method of claim 2 further including adjusting a speed of the conveyor belt to tune the step of illuminating.

4. The method of claim 3 wherein the step of illuminating includes adjusting a speed of the conveyor belt to provide sufficient time for illumination of the wafer according to a type of light source that is used and the amount of predetermined thermal stress to be delivered to the wafer.

5. The method of claim 1 further including a step of calculating the predetermined thermal stress that in the step of illuminating is delivered to the plurality of wafers on the basis of an algorithm that assesses the critical stress value for breakage based upon microcracks.

6. The method of claim 1 wherein the step of illuminating is performed sequentially on the plurality of wafers.

7. The method of claim 1 wherein the step of illuminating is performed simultaneously on the plurality of wafers.

8. The method of claim 1 wherein a light source used in the step of illuminating comprises a tungsten halogen light source.

9. The method of claim 1 , further including a step of recirculating broken wafers as feedstock for use in wafer production.

10. The method of claim 1 , wherein the plurality of wafers used in the step of presenting are silicon wafers.

11. The method of claim 1 , further including a step of depositing layers of unbroken wafers of the plurality of wafers to form an electronic device.

12. The method of claim 11 , wherein the step of depositing additional layers forms a photovoltaic cell.

13. A system for screening a wafer, which comprises:

means for presenting a plurality of wafers for illumination, wherein the plurality of wafers contain a first set of wafers that are suitable for use in subsequent deposition steps and a second set of wafers that are unsuited for use in subsequent deposition steps by virtue of cracking; and

means for illuminating the plurality of wafers with a light source that imparts a predetermined thermal stress to the plurality of wafers such that that wafers in the second set of wafers incur substantial breakage determined as a percentage of broken wafers in the second set of wafers of the and wafers in the first set of wafers do not incur substantial breakage determined as a percentage of broken wafers in the second set of wafers.

14. The system of claim 13 wherein the means for presenting includes a conveyor belt to advance the plurality of wafers under illumination.

15. The system of claim 14 further including means for adjusting a speed of the conveyor belt to tune the means for illuminating.

16. The system of claim 15 wherein the means for adjusting includes means for adjusting a speed of the conveyor belt to provide sufficient time for illumination of the wafer according to a type of light source that is used and the amount of predetermined thermal stress to be delivered to the wafer.

17. The system of claim 13 further including means for calculating the predetermined thermal stress that the means for illuminating delivers to the plurality of wafers on the basis of an algorithm that assesses the critical stress value for breakage based upon microcracks.

18. The system of claim 13 wherein the means for illuminating includes means for sequentially illuminating the plurality of wafers.

19. The system of claim 13 wherein the means for illuminating includes means for simultaneously illuminating the plurality of wafers.

20. The system of claim 13 wherein the means for illuminating includes a tungsten halogen light source.

21. The system of claim 13 , further comprising the plurality of wafers as silicon wafers.

22. The system of claim 1 , further including means for forming layers on unbroken wafers of the plurality of wafers to provide an electronic device.

23. The method of claim 12 , wherein means for forming additional layers includes means for forming a photovoltaic cell.