IP Library Granted Patent US 7,859,587
Granted Patent B2
US 7,859,587 · App. 11/723,459 · Granted Dec 28, 2010

Solid-state image pickup device

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Quick Facts
Patent No.
US 7,859,587
App. No.
11/723,459
Granted
Dec 28, 2010
Kind
B2
Abstract

In a solid-state image pickup device, it is difficult to match an optimum incidence angle corresponding to an image height of a pixel array region with light incidence characteristics of a camera lens, thereby causing image quality deterioration due to sensitivity shading. Respective microlenses are disposed in a two-dimensional manner, i.e., in a row and a column directions. In particular, the microlenses are disposed such that each side of a disposition region where the microlenses are disposed has a concave curve with respect to a line connecting adjacent vertexes of the disposition region. In other words, a distance A H (A V ) between center points of a pair of facing sides of the disposition region is set to be smaller than a distance B H (B V ) between neighboring vertexes of the disposition region.

Claims (11)

1. A solid-state image pickup device, comprising a pixel array region, on a semiconductor substrate, where a plurality of pixels are two-dimensionally disposed in a row direction and a column direction, wherein:

each of the pixels includes:

a photoelectric conversion region; and

a microlens for converging light into the photoelectric conversion region,

disposition of the microlens is determined for each of the pixels,

the microlenses are two-dimensionally disposed with different pitches,

the microlenses are disposed in a disposition region such that an outer shape of the disposition region has at least one curve which connects two adjacent vertexes of the disposition region and is concave with respect to a line passing through the two adjacent vertexes, and

a distance between a center of the microlens and a center of said each of the pixels is set so as to increase in accordance with an increase in an image height until the image height reaches a predetermined value and to be substantially constant after the image height exceeds the predetermined value.

2. The solid-state image pickup device according to claim 1 , wherein the solid-state image pickup device is an amplifying solid-state image pickup device.

3. The solid-state image pickup device according to claim 1 , wherein the pixels are disposed such that a pitch between the pixels in a peripheral portion of the pixel array region is greater than a pitch between the pixels in a central portion of the pixel array region.

4. The solid-state image pickup device according to claim 3 , wherein the solid-state image pickup device is an amplifying solid-state image pickup device.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 3, 2014
From: PANASONIC CORPORATION (FORMERLY MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.)
To: GODO KAISHA IP BRIDGE 1
Reel/Frame 032152/0514 →
CHANGE OF NAME Recorded Nov 20, 2008
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 021897/0534 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 20, 2007
From: KATSUNO, MOTONARI; MIYAGAWA, RYOHEI
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 019853/0708 →