Method of applying patterned metallization to block filter resonators

1. A method comprising:

obtaining a ceramic block comprising a dielectric material;

applying a photodefinable ink made of a photosensitive metal ink containing metal particles and photosensitive organic compounds to a surface of the dielectric material of said ceramic block to form a photodefinable layer on the surface of the dielectric material of the ceramic block;

drying the photodefinable layer;

exposing for a predetermined amount of time a portion of the photodefinable layer to UV radiation through a predefined mask based on a film thickness resulting in an organic-metal particles containing-composition pattern on the surface of the dielectric material of the ceramic block;

applying a developer solution to an unexposed portion of the photodefinable layer to dissolve the unexposed portion of the photodefinable layer on the surface of the dielectric material of the ceramic block;

rinsing the organic-metal particles containing-composition pattern on the surface of the dielectric material of the ceramic block; and

drying the ceramic block having the organic-metal particles containing-composition pattern on the surface of the dielectric material thereof.

2. The method of claim 1 , comprising firing the ceramic block having the organic-metal particles containing-composition pattern on the surface of the dielectric material thereof.

3. The method of claim 2 , wherein firing time is between 1.5 to 2 hours, and wherein drying time for the photodefinable layer is between 5 to 30 minutes.

4. The method of claim 1 , wherein the obtained ceramic block comprises a metalized through-hole, and wherein the organic-metal particles containing-composition pattern is positioned on the surface of the dielectric material of the ceramic block in contact with the metalized through-hole to provide inter-cavity coupling with another organic-metal particles containing-composition pattern positioned on a surface of dielectric material of another ceramic block having another metalized through-hole.

5. The method of claim 1 , wherein the organic-metal particles containing-composition pattern on the surface of the dielectric material of the ceramic block is formed without performing chemical etching.

6. The method of claim 1 , wherein the organic-metal particles containing-composition pattern on the surface of the dielectric material of the ceramic block is formed without performing trimming to obtain desired dimensions.

7. The method of claim 1 , wherein the organic-metal particles containing-composition pattern on the surface of the dielectric material of the ceramic block is formed without performing vacuum metallization.

8. The method of claim 1 , wherein the applying of the developer solution is performed utilizing immersion developing.

9. The method of claim 1 , wherein the exposing of the portion of the photodefinable layer to the UV radiation through the predefined mask is performed utilizing proximity exposure.

10. The method of claim 1 , wherein the organic-metal particles containing-composition pattern on the surface of the dielectric material of the ceramic block is formed without performing annealing after the step of drying the ceramic block.

11. A method comprising:

obtaining a ceramic block comprising a dielectric material and a metalized through-hole, wherein the metalized through-hole extends entirely through the ceramic block between opposing sides of the ceramic block;

applying a photodefinable metal paste to a surface of the ceramic block including contact with the dielectric material to form a photodefinable layer on the surface of the ceramic block, wherein the photodefinable metal paste comprises metal particles and photosensitive organic compounds;

drying the photodefinable layer;

exposing for a predetermined amount of time a portion of the photodefinable layer to UV radiation through a predefined mask based on a film thickness resulting in an organic-metal particles containing-composition pattern on the surface of the ceramic block that is in contact with the metalized through-hole;

applying a developer solution to an unexposed portion of the photodefinable layer to dissolve the unexposed portion of the photodefinable layer on the surface of the ceramic block;

rinsing the organic-metal particles containing-composition pattern on the surface of the ceramic block; and

firing the ceramic block having the organic-metal particles containing-composition pattern on the surface thereof.

12. The method of claim 11 , wherein the organic-metal particles containing-composition pattern is positioned on the ceramic block to provide inter-cavity coupling with another organic-metal particles containing-composition pattern positioned on a surface of another ceramic block that comprises a dielectric material and a metalized through-hole.

13. The method of claim 11 , wherein the organic-metal particles containing-composition pattern defines an electrode pattern for at least one of an RF input/output solder pad, a DC bias port, coupling lines or varactor mounting pads.

14. The method of claim 11 , wherein the organic-metal particles containing-composition pattern on the surface of the ceramic block is formed without performing chemical etching.

15. The method of claim 11 , wherein the organic-metal particles containing-composition pattern on the surface of the ceramic block is formed without performing trimming to obtain desired dimensions.

16. The method of claim 11 , wherein the organic-metal particles containing-composition pattern on the surface of the ceramic block is formed without performing vacuum metallization.

17. The method of claim 11 , wherein the organic-metal particles containing-composition pattern on the surface of the dielectric material of the ceramic block is formed without performing annealing after the firing step.

18. A method comprising:

obtaining a ceramic block comprising a plurality of sides, a dielectric material and a metalized through-hole, wherein the metalized through-hole extends entirely through the ceramic block between opposing sides of the plurality of sides of the ceramic block;

applying a photodefinable metal paste to at least two sides of the plurality of sides of the ceramic block including contact with the dielectric material to form a photodefinable layer on a surface of the dielectric material of the ceramic block, wherein the photodefinable metal paste comprises metal particles and photosensitive organic compounds;

drying the photodefinable layer;

exposing for a predetermined amount of time a portion of the photodefinable layer to UV radiation through a predefined mask based on a film thickness resulting in an organic-metal particles containing-composition pattern on the surface of the dielectric material of the ceramic block that is in contact with the metalized through-hole;

applying a developer solution to an unexposed portion of the photodefinable layer to dissolve the unexposed portion of the photodefinable layer on the surface of the dielectric material of the ceramic block;

rinsing the organic-metal particles containing-composition pattern on the surface of the dielectric material of the ceramic block; and

firing the ceramic block having the organic-metal particles containing-composition pattern on the surface of the dielectric material thereof.

19. The method of claim 18 , wherein the organic-metal particles containing-composition pattern is positioned on the ceramic block to provide inter-cavity coupling with another organic-metal particles containing-composition pattern positioned on a surface of another ceramic block that comprises a dielectric material.

20. The method of claim 18 , wherein the organic-metal particles containing-composition pattern on the surface of the ceramic block is formed without performing: chemical etching, trimming to obtain desired dimensions, vacuum metallization, and annealing after the firing step.