Solid-state imaging apparatus and method for producing the same
View Patent ↗A solid-state imaging apparatus includes a plurality of photosensitive cells, and a driving unit provided for driving the plurality of photosensitive cells. Each photosensitive cell includes a photodiode formed to be exposed on a surface of a semiconductor substrate for the purpose of accumulating signal charge obtained by subjecting incident light to photoelectric conversion, a transfer transistor for transferring signal charge accumulated by the photodiode, a floating diffusion layer for temporarily accumulating signal charge transferred by the transfer transistor, and an amplifier transistor for amplifying signal charge temporarily accumulated in the floating diffusion layer. A source/drain diffusion layer provided in the amplifier transistor is covered with a salicide layer, and the floating diffusion layer is formed to be exposed on a surface of the semiconductor substrate.
1. A method for producing a solid-state imaging apparatus comprising:
a plurality of photosensitive cells disposed in a matrix in a photosensitive region on a semiconductor substrate; and
a driving unit for driving the plurality of photosensitive cells,
wherein each of the photosensitive cells includes:
a photodiode formed to be exposed on a surface of the semiconductor substrate, for accumulating signal charge obtained by subjecting incident light to photoelectric exchange;
a transfer transistor formed on the semiconductor substrate, for transferring the signal charge accumulated in the photodiode;
a floating diffusion layer formed on the semiconductor substrate, for temporarily accumulating the signal charge transferred by the transfer transistor; and
an amplifier transistor formed on the semiconductor substrate, for amplifying the signal charge temporarily accumulated in the floating diffusion layer,
wherein a source/drain diffusion layer provided in the amplifier transistor is covered with a salicide layer, and the floating diffusion layer is formed to be exposed on the surface of the semiconductor substrate,
the method comprising:
forming the photodiode, the transfer transistor, and the amplifier transistor on the semiconductor substrate;
forming a resist in a predetermined pattern so as to cover the photodiode, the transfer transistor, and the amplifier transistor;
implanting ions into the semiconductor substrate using the resist as a mask so as to form the floating diffusion layer;
removing the resist and forming a salicide blocking film so as to cover the floating diffusion layer and the photodiode;
forming a source/drain diffusion layer of the amplifier transistor; and
forming a salicide layer so as to cover the source/drain diffusion layer of the amplifier transistor.
2. The method for producing the solid-state imaging apparatus according to claim 1 , wherein an impurity concentration of the floating diffusion layer is lower than an impurity concentration of the source/drain diffusion layer of the amplifier transistor.
3. A method for producing a solid-state imaging apparatus comprising:
a plurality of photosensitive cells disposed in a matrix in a photosensitive region on a semiconductor substrate; and
a driving unit for driving the plurality of photosensitive cells,
wherein each of the photosensitive cells includes:
a photodiode formed to be exposed on a surface of the semiconductor substrate, for accumulating signal charge obtained by subjecting incident light to photoelectric exchange;
a transfer transistor formed on the semiconductor substrate, for transferring the signal charge accumulated in the photodiode;
a floating diffusion layer formed on the semiconductor substrate, for temporarily accumulating the signal charge transferred by the transfer transistor; and
an amplifier transistor formed on the semiconductor substrate, for amplifying the signal charge temporarily accumulated in the floating diffusion layer,
wherein a source/drain diffusion layer provided in the amplifier transistor is covered with a salicide layer, and the floating diffusion layer is formed to be exposed on the surface of the semiconductor substrate,
the method comprising:
forming a resist in a predetermined pattern on the semiconductor substrate;
implanting ions using the resist as a mask so as to form the photodiode;
removing the resist and forming the transfer transistor and the amplifier transistor on the semiconductor substrate;
forming a first salicide blocking film so as to cover the photodiode;
implanting ions into the semiconductor substrate so as to form the floating diffusion layer and the source/drain diffusion layer of the amplifier transistor;
forming a second salicide blocking film so as to cover the floating diffusion layer; and
forming a salicide layer so as to cover the source/drain diffusion layer of the amplifier transistor.
4. The method for producing the solid-state imaging apparatus according to claim 3 , wherein an impurity concentration of the floating diffusion layer is lower than an impurity concentration of the source/drain diffusion layer of the amplifier transistor.
5. A method for producing a solid-state imaging apparatus comprising:
a plurality of photosensitive cells disposed in a matrix in a photosensitive region on a semiconductor substrate; and
a driving unit for driving the plurality of photosensitive cells,
wherein each of the photosensitive cells include:
a photodiode formed to be exposed on a surface of the semiconductor substrate, for accumulating signal charge obtained by subjecting incident light to photoelectric exchange;
a transfer transistor formed on the semiconductor substrate, for transferring the signal charge accumulated in the photodiode;
a floating diffusion layer formed on the semiconductor substrate, for temporarily accumulating the signal charge transferred by the transfer transistor;
an amplifier transistor formed on the semiconductor substrate, for amplifying the signal charge temporarily accumulated in the floating diffusion layer; and
a plurality of transistors constituting a horizontal driver circuit and a vertical driver circuit,
wherein a source/drain diffusion layer provided in the transistors of the driver circuits are covered with a salicide layer, and the floating diffusion layer is formed to be exposed on the surface of the semiconductor substrate,
the method comprising:
forming the photodiode, the transfer transistor, the amplifier transistor, and the transistors of the driver circuits on the semiconductor substrate;
forming a resist in a predetermined pattern so as to cover the photodiode, the transfer transistor, the amplifier transistor, and the transistors of the driver circuits;
implanting ions into the semiconductor substrate using the resist as a mask so as to form the floating diffusion layer;
removing the resist and forming a salicide blocking film so as to cover the floating diffusion layer and the photodiode;
forming a source/drain diffusion layer of the amplifier transistor; and
forming a salicide layer so as to cover the source/drain diffusion layer of the transistors of the driver circuit.
6. The method for producing the solid-state imaging apparatus according to claim 5 , wherein an impurity concentration of the floating diffusion layer is lower than an impurity concentration of the source/drain diffusion layer of the transistors of the driver circuits.