Piezoelectric device and method for manufacturing the same

1. A piezoelectric device, comprising:

a substrate having an electrode terminal portion on an upper surface thereof;

an electronic part arranged on an upper side of the substrate; and

a piezoelectric resonator arranged on an upper side of the electronic part,

wherein a surface of the electronic part opposite to a surface having a pad portion is bonded to a lower surface of the piezoelectric resonator having an external terminal portion and the pad portion of the electronic part and the external terminal portion of the piezoelectric resonator are wire-bonded to each other, and

wherein the surface of the electronic part having the pad portion is face-down mounted on the upper surface of the substrate.

2. The piezoelectric device according to claim 1 , wherein the electronic part is flip-chip connected to the substrate by using a bump and the height of the bump is greater than such a height that a wire for the wire bonding comes into contact with the substrate.

3. The piezoelectric device according to claim 1 , wherein a portion defining one of a through hole and a cutout portion is formed at the substrate so as to correspond to a position at which wire bonding of the pad portion and the external terminal portion is performed.

4. The piezoelectric device according to claim 1 , wherein at least a space between the lower surface of the piezoelectric resonator and the upper surface of the substrate is molded by using resin so that the upper surface of the piezoelectric resonator is exposed to the outside.