IP Library Granted Patent US 8,525,224
Granted Patent B2
US 8,525,224 · App. 11/729,742 · Granted Sep 3, 2013

III-nitride power semiconductor device

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,525,224
App. No.
11/729,742
Granted
Sep 3, 2013
Kind
B2
Abstract

A III-nitride power semiconductor device that includes a first III-nitride power semiconductor device and a second III-nitride power semiconductor device formed in a common semiconductor die and operatively integrated to form a half-bridge.

Claims (18)

1. A semiconductor device comprising:

a semiconductor body having formed therein a lateral conduction power semiconductor device, and

a vertical conduction power semiconductor device having a lateral conductive channel and a vertical conductive path coupled to said lateral conductive channel to transmit current from said lateral conductive channel to a conductive electrode disposed on an outer surface of said semiconductor body opposite said lateral conductive channel, wherein a first power electrode and a second power electrode of said vertical conduction power semiconductor are not interdigitated;

said lateral conduction power semiconductor device and said vertical conduction power semiconductor device sharing a continuous two dimensional electron gas (2DEG) conduction path.

2. The semiconductor device of claim 1 , wherein said lateral condition power semiconductor device is a lateral conduction heterojunction III-nitride semiconductor device, and said vertical conduction power semiconductor device is a vertical conduction III-nitride semiconductor device.

3. The power semiconductor device of claim 1 , further comprising a power input electrode, and a power output electrode on one surface of said semiconductor body and a ground electrode on a second opposite surface of said semiconductor body.

4. The semiconductor device of claim 3 , further comprising a control electrode for receiving control signals to control the operation of said lateral conduction device and a control electrode for receiving control signals to control the operation of said vertical conduction device on said first surface of said semiconductor body.

5. The semiconductor device of claim 3 , wherein said lateral conduction device includes a control electrode and said vertical conduction device includes a control electrode, each said control electrode being disposed on one side of said power input electrode.

6. The semiconductor device of claim 1 , wherein said lateral conduction device is configured to function as a control switch in a buck converter and said vertical conduction device is configured to function as a synchronous switch in said buck converter.

7. The power semiconductor device of claim 1 , wherein said lateral conduction device includes a first power electrode and a second power electrode, said first power electrode serving as an input voltage electrode and said second power electrode being shorted to an output voltage electrode.

8. The semiconductor device of claim 7 , wherein said power electrodes of said lateral conduction device are interdigitated.

9. The semiconductor device of claim 1 , wherein said first power electrode of said vertical conduction device is disposed on one surface of said semiconductor body and said second power electrode of said vertical conduction device is disposed on another opposing surface of said semiconductor body, said first power electrode serving as a voltage output electrode and said second power electrode serving as a ground electrode.

10. A III-nitride power device comprising:

a first III-nitride power semiconductor device and a second III-nitride power semiconductor device sharing a common III-nitride active heterojunction that includes a continuous two dimensional electron gas,

wherein a source electrode of said first III-nitride power semiconductor device is directly connected in series to a drain electrode of said second III-nitride power semiconductor device and wherein said drain electrode and a source electrode of said second III-nitride power semiconductor device are not interdigitated.

11. The III-nitride power device of claim 10 , wherein said first III-nitride power semiconductor device is a lateral conduction switch and said second III-nitride power semiconductor device is a vertical conduction switch.

12. The III-nitride power device of claim 10 , wherein said first Ill-nitride power semiconductor device is adapted to function as a control switch in a power converter, and said second III-nitride power semiconductor device is adapted to function as a synchronous switch in said power converter.

13. The III-nitride power device of claim 12 , wherein said power converter is a buck converter.

Assignments (2)
CHANGE OF NAME Recorded Jul 23, 2018
From: INTERNATIONAL RECTIFIER CORPORATION
To: INFINEON TECHNOLOGIES AMERICAS CORP.
Reel/Frame 046612/0968 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 29, 2007
From: KINZER, DANIEL M.
To: INTERNATIONAL RECTIFIER CORPORATION
Reel/Frame 019178/0567 →