IP Library Granted Patent US 7,465,026
Granted Patent B2
US 7,465,026 · App. 11/730,386 · Granted Dec 16, 2008

Nozzle arrangement with thermally operated ink ejection piston

Assignee: Silverbrook Research Pty Ltd
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Quick Facts
Patent No.
US 7,465,026
App. No.
11/730,386
Granted
Dec 16, 2008
Kind
B2
Abstract

A nozzle arrangement is, provided for an inkjet printhead. The nozzle arrangement includes a wafer substrate assembly defining an ink inlet channel. A nozzle chamber structure is mounted to the wafer substrate assembly and defines a nozzle chamber in fluid communication with the ink inlet channel. The nozzle chamber structure further defines an ink ejection port through which ink in the nozzle chamber can be ejected. An electro-thermal actuator is mounted relative to the wafer substrate assembly and includes an electrically conductive heating element. A piston is coupled relative to the electro-thermal actuator so that, upon actuation of the actuator, the piston moves rectilinearly along the nozzle chamber to eject ink through the ink ejection port.

Claims (13)

1. A nozzle arrangement for an inkjet printhead, the nozzle arrangement comprising:

a wafer substrate assembly defining an ink inlet channel;

a nozzle chamber structure mounted to the wafer substrate assembly and defining a nozzle chamber in fluid communication with the ink inlet channel, the nozzle chamber structure further defining an ink ejection port through which ink in the nozzle chamber can be ejected;

an electro-thermal actuator mounted relative to the wafer substrate assembly and comprising an electrically conductive heating element; and

a piston coupled relative to the electro-thermal actuator so that, upon actuation of the actuator, the piston moves rectilinearly along the nozzle chamber to eject ink through the ink ejection port.

2. A nozzle arrangement as claimed in claim 1 , wherein the conductive heating element is a beam which is cantilevered relative to the wafer substrate assembly so that the beam rectilinearly expands along an axis upon its actuation, and the piston is directly coupled to the wafer substrate assembly so that the piston also moves along the axis.

3. A nozzle arrangement as claimed in claim 1 , wherein the cross sectional area of the nozzle chamber is at least five times the cross sectional area of the ink ejection port.

4. A nozzle arrangement as claimed in claim 3 , wherein the cross sectional area of the nozzle chamber is about ten times the cross sectional area of the ink ejection port.

5. A nozzle arrangement as claimed in claim 1 , wherein the conductive heating element is generally “U” shaped.

6. A nozzle arrangement as claimed in claim 1 , further comprising a motion amplifying means which is coupled between the conductive heating element and the piston.

7. A nozzle arrangement as claimed in claim 1 , further comprising a lever mechanism which interconnects the conductive heating element and the piston so that the piston is driven rectilinearly.

8. A nozzle arrangement as claimed in claim 7 , wherein the lever mechanism has a ratio of between 20 and 60 to 1.

9. A nozzle arrangement as claimed in claim 8 , wherein the lever mechanism has a ratio of about 40 to 1.

Assignments (3)
CHANGE OF NAME Recorded Jun 25, 2014
From: ZAMTEC LIMITED
To: MEMJET TECHNOLOGY LIMITED
Reel/Frame 033244/0276 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 17, 2012
From: SILVERBROOK RESEARCH PTY. LIMITED AND CLAMATE PTY LIMITED
To: ZAMTEC LIMITED
Reel/Frame 028569/0828 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 2, 2007
From: SILVERBROOK, KIA
To: SILVERBROOK RESEARCH PTY LTD
Reel/Frame 019178/0613 →
Priority Claims (2)
AU PO7991 · Jul 15, 1997 · national
AU PP2592 · Mar 25, 1998 · national
Continuity (7)
Continuation 1147229400 · Jun 22, 2006
Continuation 1128142000 · Nov 18, 2005
Continuation 1102613100 · Jan 3, 2005
Continuation 1030260500 · Nov 23, 2002
Continuation 1012034500 · Apr 12, 2002
Continuation In Part 0911276700 · Jul 10, 1998
Related Publication 20070171255A1 · Jul 26, 2007