IP Library Granted Patent US 8,536,664
Granted Patent B1
US 8,536,664 · App. 11/735,803 · Granted Sep 17, 2013

MEMS device with integrated memory cells

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Quick Facts
Patent No.
US 8,536,664
App. No.
11/735,803
Granted
Sep 17, 2013
Kind
B1
Abstract

A MEMS device can include an actuator, a base formed from a substrate, and a plurality of memory cells integrated with the base. At least a portion of the base can be configured to move in response to the actuator. A miniature camera can include a base comprising a frame, a stage, and a plurality of flexures configured to connect the stage with the frame. The flexures can be adapted to bend to permit the stage to move relative to the frame. The camera can include a plurality of memory cells integrated with the base, a lens mount secured to the stage, a lens barrel secured to the lens mount, an image sensor, and an actuator adapted to move the stage relative to the frame and the image sensor.

Claims (26)

1. A miniature camera including a micro-electro-mechanical systems (MEMS) device, the miniature camera comprising:

a frame of the MEMS device disposed within the miniature camera;

a stage of the MEMS device also disposed within the miniature camera;

a plurality of flexures coupling the stage to the frame for translational movement of the stage relative to the frame, wherein the frame and the stage are semiconductor structures; and

a plurality of single-layer fuses disposed directly on a surface of at least one of the stage or plurality of flexures, wherein the stage and plurality of flexures are portions of the MEMS device that are adapted to move relative to the frame, and wherein the single layer fuses are adapted to store characteristic information associated with the MEMS device.

2. The MEMS device of claim 1 , wherein the semiconductor structures comprise a generally planar base, and the MEMS device further comprises an actuator adapted to actuate the stage relative to the frame.

3. The MEMS device of claim 2 , wherein the frame, stage, and flexures comprise one integral body formed from a semiconductor substrate.

4. The MEMS device of claim 2 , wherein the base is adapted to support a lens mount of a miniature camera.

5. The MEMS device of claim 1 , wherein each of the single layer fuses comprises first and second conductive portions, the single layer fuses forming blown fuses and intact fuses, wherein the intact fuses include a conductive path between the first and second conductive portions, and wherein a portion of read/write circuitry for the single layer fuses is integrated with at least one of the plurality of flexures and adapted to program and/or read logic states of fuses on the stage during operation of the MEMS device.

6. The MEMS device of claim 3 , wherein the semiconductor substrate comprises silicon.

7. The MEMS device of claim 1 , wherein the MEMS device is configured to be part of a personal electronic device.

8. The miniature camera of claim 1 , further comprising at least one additional single-layer fuse disposed directly on a surface of the frame.

9. A miniature camera, comprising:

a frame;

a stage;

a plurality of flexures coupling the stage to the frame for translational movement of the stage relative to the frame, wherein the frame and the stage are semiconductor structures;

a plurality of single-layer fuses disposed directly on a surface of at least one of the stage or plurality of flexures, wherein the stage and plurality of flexures are portions of the MEMS device that are adapted to move relative to the frame, and wherein the single layer fuses are adapted to store characteristic information associated with the MEMS device;

a lens secured to the stage;

an image sensor adapted to capture images from light received through the lens; and

an actuator adapted to move the stage relative to the frame and the image sensor.

10. The miniature camera of claim 9 , wherein each of the single layer fuses comprises: first and second conductive portions, the single layer fuses forming blown fuses and intact fuses, wherein the intact fuses include a conductive path between the first and second conductive portions.

11. The miniature camera of claim 9 , wherein the single layer fuses are further adapted to store characteristic information associated with the miniature camera.

12. The miniature camera of claim 9 , wherein the frame, stage, and flexures comprise one integral body formed from a substrate.

13. The miniature camera of claim 12 , wherein the substrate comprises silicon.

14. The miniature camera of claim 9 , wherein the miniature camera is configured to be part of a personal electronic device.

15. The miniature camera of claim 9 , further comprising at least one additional single-layer fuse disposed directly on a surface of the frame.

Assignments (9)
SECURITY INTEREST Recorded May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.; ADEIA SEMICONDUCTOR ADVANCED TECHNOLOGIES INC.; ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.; ADEIA SEMICONDUCTOR INC.; ADEIA SEMICONDUCTOR SOLUTIONS LLC; ADEIA SEMICONDUCTOR TECHNOLOGIES LLC; ADEIA SOLUTIONS LLC
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
RELEASE OF SECURITY INTEREST Recorded Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION; TESSERA ADVANCED TECHNOLOGIES, INC; DTS, INC.; DTS LLC; PHORUS, INC.; IBIQUITY DIGITAL CORPORATION
Reel/Frame 052920/0001 →
SECURITY INTEREST Recorded Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.; DIGITALOPTICS CORPORATION; DIGITALOPTICS CORPORATION MEMS; DTS, LLC; DTS, INC.; PHORUS, INC.; IBIQUITY DIGITAL CORPORATION
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
CHANGE OF NAME Recorded Aug 23, 2011
From: TESSERA MEMS TECHNOLOGIES, INC.
To: DIGITALOPTICS CORPORATION MEMS
Reel/Frame 026795/0302 →
CHANGE OF NAME Recorded Sep 24, 2010
From: SIIMPEL CORPORATION
To: TESSERA MEMS TECHNOLOGIES, INC.
Reel/Frame 025042/0290 →
RELEASE OF SECURITY INTEREST Recorded May 7, 2010
From: SCALE VENTURE PARTNERS II, L.P.
To: SIIMPEL CORPORATION
Reel/Frame 024351/0353 →
PATENT SECURITY AGREEMENT Recorded Mar 31, 2010
From: SIIMPEL CORPORATION
To: SCALE VENTURE PARTNERS II, L.P.
Reel/Frame 024170/0078 →
PATENT SECURITY AGREEMENT Recorded Nov 16, 2009
From: SIIMPEL CORPORATION
To: SCALE VENTURE PARTNERS II, L.P., AS COLLATERAL AGENT
Reel/Frame 023519/0715 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 16, 2007
From: TSAI, RICHARD; LIU, XIAOLEI
To: SIIMPEL CORPORATION
Reel/Frame 019166/0672 →