Surface mounting device-type light emitting diode
View Patent ↗A surface mounting device-type light emitting diode (SMD-type LED) comprises a lead frame composed of a pair of lead terminals; a package housing a portion of the lead frame therein, the package having an emission window which is opened so that light is emitted through the emission window; an LED chip mounted on the lead frame inside the package; a wire for electrically connecting the LED chip and the lead frame; and a molding material filled in the package, the molding material having surface irregularities with a predetermined shape formed on the surface thereof which is exposed through the emission window of the package.
1. A surface mounting device-type light emitting diode (SMD-type LED) comprising:
a lead frame composed of a pair of lead terminals;
a package housing a portion of the lead frame therein, the package having an emission window which is opened so that light is emitted through the emission window;
an LED chip mounted on the lead frame inside the package;
a wire for electrically connecting the LED chip and the lead frame; and
a molding material filled in the package, the molding material having surface irregularities with a predetermined shape formed on the surface thereof which is exposed through the emission window of the package.
2. The SMD-type LED according to claim 1 ,
wherein the surface irregularities are composed of one or more lines.
3. The SMD-type LED according to claim 1 ,
wherein the surface irregularities are formed through an ion-beam etching process.
4. The SMD-type LED according to claim 3 ,
wherein the ion-beam etching process is performed by using argon (Ar) as etching ions.
5. The SMD-type LED according to claim 1 ,
wherein the molding material is composed of any one selected from transparent epoxy, silicon, and a phosphor mixture.
6. The SMD-type LED according to claim 1 , wherein the surface irregularities are formed to have different depths and widths.
7. The SMD-type LED according to claim 1 , wherein the surface irregularities form an erratic and irregular surface.
8. A method of forming a surface mounting device-type light emitting diode (SMD-type LED) comprising:
disposing an LED chip on a lead frame inside a package housing having an emission window which is opened so that light is emitted through the emission window;
a lead frame composed of a pair of lead terminals;
filling a molding material in the package;
irradiating etching ions on the LED using an ion gun to form surface irregularities on an outer surface of the molding material, the surface irregularities formed to have a different depth and width depending upon a number of irradiated ions.