Label with electronic components and method of making same
A method of making an electronic label, such as an RFID label, includes attaching a circuit, such as an antenna, to a substrate material, applying an adhesive layer to the substrate material over the circuit, adding a release layer over the adhesive layer, forming at least one opening in the release layer to expose at least one portion of the circuit, and connecting a microchip to the at least one portion of the circuit through the at least one opening. The circuit can be an RFID inlay, including an antenna and a microchip, and can be formed of a conductive ink. A portion of the release layer at the at least one microchip has an opening to expose the at least one microchip so that the at least one microchip is free from coverage by the release layer.
1. A label web comprising;
a web of material, the material web having first and second sides;
a plurality of antennas each having antenna contacts applied to the first side of the web;
a removable release layer and an adhesive layer applied over the plurality of antennas, the web with the plurality of antennas is provided without a microchip;
a printable surface on the second side of the web; and
wherein the release layer and adhesive layer each have at least one opening over each of the antenna contacts of the plurality of antennas wherein the opening is sized and configured to receive a microchip; and
wherein multiple microchips are coupled to respective antennas through respective openings.
2. The label web of claim 1 , wherein the antennas and the microchips constitute multiple RFID inlays.
3. The label web of claim 1 , further comprising chip adhesive in the openings coupling the microchips to the antennas.
4. The label web of claim 1 , wherein the microchips are part of interposers that couple the microchips to the antennas.
5. The label web of claim 4 , wherein the interposers have extension leads for connection to antenna contacts of the antennas.
6. The label web of claim 1 , wherein the antennas include a conductive ink.
7. The label web of claim 6 , wherein the antennas are lithographed antennas.
8. The label web of claim 1 , wherein the antennas include a metal foil.
9. The label web of claim 1 , wherein the antennas include sputtered conductive material.
10. The label web of claim 1 , wherein the release layer is applied over the adhesive layer.
11. The label web of claim 1 , wherein the at least one opening in the adhesive layer is produced by removing a portion of a substantially-uniform adhesive layer.
12. The label web of claim 1 , wherein the label web is part of a roll of labels.
13. The label web of claim 1 , wherein the material web is a paper web.
14. The label web of claim 1 , wherein the material web is a plastic web.
15. The label web of claim 1 , wherein the material web is a rigid web.
16. The label web of claim 1 , wherein the adhesive layer includes a pair of adhesive strips.
17. A pressure sensitive label, comprising;
a substrate having first and second sides;
an antenna, having antenna contacts is applied to the first side;
printed indicia on the second side;
a removable release layer and an adhesive layer applied over the antenna, the substrate and antenna are
provided without a microchip; and
wherein each of the release layer and the adhesive layer has an opening over the antenna contacts wherein the opening is sized and configured to receive a microchip; and
wherein multiple microchips are coupled to respective antennas through respective openings.
18. A pressure sensitive web of material, comprising:
a substrate having first and second sides;
a series of antennas each having antenna contacts applied to the first side; printed indicia applied to the second side; and
a removable release layer and an adhesive layer applied over the series of antennas, the substrate with antennas is provided without a microchip;
wherein for each of the antenna contacts there is an opening extending through each of the adhesive layer and the release layer wherein the opening is sized and configured to receive a microchip; and
wherein the opening is sized and configured to receive a microchip; and wherein multiple microchips are coupled to respective antennas through respective openings.