Pre-distortion based impedence discontinuity remediation for via stubs and connectors in printed circuit board design
View Patent ↗Embodiments of the present invention address deficiencies of the art in respect to via structure utilization in a PCB design and provide a novel and non-obvious method, system and computer program product for impedance discontinuity remediation for via stubs and connectors in a PCB. In one embodiment a method for impedance discontinuity remediation in a PCB can be provided. The method can include configuring a pre-distortion filter to negate an impedance discontinuity in an electrical signal caused by a transmission line with one of a via stub or a connector. The method further can include pre-distortion filtering an electrical signal before transmitting the electrical signal over the transmission line. Finally, the method can include transmitting the pre-distortion filtered electrical signal over the transmission line.
1. A method for impedance discontinuity remediation for via stubs in a printed circuit board (PCB), the method comprising:
configuring a pre-distortion filter to negate an impedance discontinuity in an electrical signal caused by a transmission line with one of a via stub and a connector;
pre-distortion filtering an electrical signal before transmitting the electrical signal over the transmission line; and,
transmitting the pre-distortion filtered electrical signal over the transmission line.
2. The method of claim 1 , wherein configuring the pre-distortion filter comprises:
determining an error response for the transmission line;
applying an inverse Fourier transform to the error response to produce a transfer function; and,
selecting coefficients for the transfer function based upon maximizing peak energy in a resulting pulse shape.