IP Library Granted Patent US 8,509,487
Granted Patent B2
US 8,509,487 · App. 11/737,234 · Granted Aug 13, 2013

System and method for optically measuring a parameter of an object

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Quick Facts
Patent No.
US 8,509,487
App. No.
11/737,234
Granted
Aug 13, 2013
Kind
B2
Abstract

A system and method for optically measuring a parameter of an object uses a first segment of the object captured as a first frame of image data using a first imaging region of an image sensor array and a second segment of the object as a second frame of image data using a second imaging region of the image sensor array, which is larger than the first imaging region, to determine a displaced distance of the object relative to the image sensor array.

Claims (29)

1. A method for optically measuring a parameter of an object, said method comprising:

electronically capturing a first segment of said object as a first frame of image data at a first time using a first imaging region of an image sensor array, said first imaging region being defined by a first set of photosensitive pixel elements of the image sensor array;

electronically capturing a second segment of said object as a second frame of image data at a second time using a second imaging region of said image sensor array, said second imaging region being larger than said first imaging region, said second imaging region being defined by a second set of photosensitive pixel elements of the image sensor array, said second set of photosensitive pixel elements including a greater number of photosensitive pixel elements than said first set of photosensitive pixel elements;

comparing said first frame of image data with portions of said second frame of image data to determine a potential matched portion from said portions of said second frame of image data; and

determining a displaced distance of said object using the position of said potential matched portion within said second frame of image data and a reference initial position within said second frame of image data.

2. The method of claim 1 wherein said electronically capturing said first segment of said object as said first frame of image data includes electronically capturing said first segment of said object as said first frame of image data using a single column of photosensitive pixel elements of said image sensor array, said single column of photosensitive pixel elements defining said first imaging region of said image sensor array.

3. The method of claim 2 wherein said single column of photosensitive pixel elements of said image sensor array is the first column of photosensitive pixel elements from a side of said image sensor array.

4. The method of claim 1 wherein said electronically capturing said first segment of said object as said first frame of image data includes electronically capturing said first segment of said object as said first frame of image data using multiple columns of photosensitive pixel elements of said image sensor array, said multiple columns of photosensitive pixel defining said first imaging region of said image sensor array.

5. The method of claim 1 wherein said electronically capturing said second segment of said object includes electronically capturing said second segment of said object using all photosensitive pixel elements of said image sensor array.

6. The method of claim 1 further comprising calculating the speed of said object relative to said image sensor array using said displaced distance.

7. The method of claim 1 wherein said electronically capturing said first segment of said object includes electronically capturing an upper surface and a side surface of said first segment of said object using said first imaging region of said image sensor array and a reflective surface positioned to reflect said side surface of said object toward said image sensor array.

8. The method of claim 1 wherein said electronically capturing said first segment of said object includes electronically capturing an upper surface and opposite side surfaces of said first segment of said object using said first imaging region of said image sensor array and first and second reflective surfaces positioned to reflect said opposite side surface of said object toward said image sensor array.

9. A system for measuring a parameter of an object, said system comprising:

an image sensor array to electronically capture a first segment of said object as a first frame of image data using a first imaging region of said image sensor array and to electronically capture a second segment of said object as a second frame of image data using a second imaging region of said image sensor array, said second imaging region being larger than said first imaging region, said first imaging region being defined by a first set of photosensitive pixel elements of the image sensor array, said second imaging region being defined by a second set of photosensitive pixel elements of the image sensor array, said second set of photosensitive pixel elements including a greater number of photosensitive pixel elements than said first set of photosensitive pixel elements; and

an image processing module operatively connected to said image sensor array, said image processing module being configured to compare said first frame of image data with portions of said second frame of image data to determine a potential matched portion from said portions of said second frame of image data, said image processing module being further configured to determine a displaced distance of said object using the position of said potential matched portion within said second frame of image data and a reference initial position within said second frame of image data.

10. The system of claim 9 further comprising at least one decoder connected to said image sensor, said at least one decoder being configured to control said image sensor array such that said first segment of said object is electronically captured as said first frame of image data using a single column of photosensitive pixel elements of said image sensor array, said single column of photosensitive pixel elements defining said first imaging region of said image sensor array.

11. The system of claim 9 wherein said single column of photosensitive pixel elements of said image sensor array is the first column of photosensitive pixel elements from a side of said image sensor array.

12. The system of claim 9 further comprising at least one decoder connected to said image sensor, said at least one decoder being configured to control said image sensor array such that said first segment of said object is electronically captured as said first frame of image data using multiple columns of photosensitive pixel elements of said image sensor array, said multiple columns of photosensitive pixel elements defining said first imaging region of said image sensor array.

13. The system of claim 9 further comprising at least one decoder connected to said image sensor, said at least one decoder being configured to control said image sensor array such that said second segment of said object is electronically captured as said second frame of image data using all photosensitive pixel elements of said image sensor array, said all photosensitive pixel elements defining said second imaging region of said image sensor array.

14. The system of claim 9 wherein said image processing module is configured to calculate the speed of said object relative to said image sensor array using said displaced distance.

15. The system of claim 9 further comprising a reflective surface positioned to reflect a side surface of said object toward said image sensor array such that an upper surface of said object and said side surface of said object can be at least partially captured in said first and second frame of image data.

16. The system of claim 9 further comprising first and second reflective surfaces positioned to reflect opposite side surfaces of said object toward said image sensor array such that an upper surface of said object and said opposite side surfaces of said object can be at least partially captured in said first and second frame of image data.

17. A system for measuring a parameter of a three-dimensional object, said system comprising:

an image sensor array to electronically capture said three-dimensional object as frames of image data;

an image processing module operatively connected to said image sensor array, said image processing module being configured to compare said frames of image data to determine displaced distances of said three-dimensional object relative to said image sensor array between said frames of image data; and

a reflective surface positioned to reflect a side surface of said three-dimensional object toward said image sensor array such that an upper surface of said three-dimensional object and said side surface of said three-dimensional object can be at least partially captured in said frames of image data,

further comprising at least one decoder connected to said image sensor, said at least one decoder being configured to control said image sensor array such that a first segment of said three-dimensional object is electronically captured as a first frame of image data using a first imaging region of said image sensor array and a second segment of said three-dimensional object is electronically captured as a second frame of image data using a second imaging region of said image sensor array, said second imaging region being larger than said first imaging region, said first imaging region being defined by a first set of photosensitive pixel elements of the image sensor array, said second imaging region being defined by a second set of photosensitive pixel elements of the image sensor array, said second set of photosensitive pixel elements including a greater number of photosensitive pixel elements than said first set of photosensitive pixel elements.

18. The system of claim 17 wherein said image processing module is configured to compare said first frame of image data with portions of said second frame of image data to determine a potential matched portion from said portions of said second frame of image data, said image processing module being further configured to determine a displaced distance between the position of said potential matched portion within said second frame of image data and a reference initial position within said second frame of image data.

19. The system of claim 17 wherein said at least one decoder is configured to control said image sensor array such that said first segment of said three-dimensional object is electronically captured as said first frame of image data using at least one column of photosensitive pixel elements of said image sensor array, said at least one column of photosensitive pixel elements defining said first imaging region of said image sensor array.

Assignments (10)
CORRECTIVE ASSIGNMENT TO CORRECT THE ERROR IN RECORDING THE MERGER IN THE INCORRECT US PATENT NO. 8,876,094 PREVIOUSLY RECORDED ON REEL 047351 FRAME 0384. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Mar 8, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 049248/0558 →
CORRECTIVE ASSIGNMENT TO CORRECT THE EFFECTIVE DATE OF THE MERGER PREVIOUSLY RECORDED AT REEL: 047230 FRAME: 0910. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Oct 29, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047351/0384 →
MERGER Recorded Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047230/0910 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032851-0001) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 037689/0001 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032851/0001 →
MERGER Recorded May 1, 2013
From: AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 030331/0533 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNOR NAME FROM "KUMAR SAXENA KULDEEP" TO "KULDEEP KUMAR SAXENA" PREVIOUSLY RECORDED ON REEL 019316 FRAME 0377. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT TO AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD. Recorded Mar 10, 2009
From: LIM, TENG HUN; SAXENA, KULDEEP KUMAR; TAN, MENG WHUI
To: AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD.
Reel/Frame 022371/0399 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 18, 2007
From: LIM, TENG HUN; KULDEEP, KUMAR SAXENA; TAN, MENG WHUI
To: AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD.
Reel/Frame 019316/0377 →