IP Library Granted Patent US 7,969,712
Granted Patent B2
US 7,969,712 · App. 11/737,484 · Granted Jun 28, 2011

Power integrity circuits with EMI benefits

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Quick Facts
Patent No.
US 7,969,712
App. No.
11/737,484
Granted
Jun 28, 2011
Kind
B2
Abstract

A stable power, low electromagnetic interference (EMI) apparatus and method for connecting electronic devices and circuit boards is disclosed. The apparatus involves a capacitor which includes a body member, a set of power terminals and a set of ground terminals connected to the top of the body member. The set of power terminals and the set of ground terminals alternate one with another. As a result of this configuration, a high inductance on the PCB side is achieved. The capacitor further includes a set of terminals connected to the bottom of the body member and includes metal planes within the body member. The metal planes are positioned to electrically connect either the set of power terminals or the set of ground terminals to the set of terminals.

Claims (5)

1. An apparatus comprising:

an electronic device;

a circuit;

a plurality of first pass-through capacitors peripherally connected between the electronic device and the circuit, the first plurality of first pass-through capacitors including alternating first power terminals and first ground terminals connected with the electronic device, the power terminals interconnected with a first metal plane and not connected with the circuit, the first ground terminals interconnected with a second metal plane dielectrically separated from the first metal plane, the first ground terminals connected by way of the second metal plane with second ground terminals connected with the circuit; and

a plurality of second pass-through capacitors connected internally relative to the first pass-through capacitors and between the electronic device and the circuit, the second plurality of pass-through capacitors including alternating third power terminals and third ground terminals connected with the electronic device, the ground terminals interconnected with a third metal plane and not connected with the circuit, the third power terminals interconnected with a fourth metal plane dielectrically separated form the third metal plane, the third power terminals connected by way of the fourth metal plane with fourth power terminals connected with the circuit.

Assignments (2)
MERGER AND CHANGE OF NAME Recorded Dec 16, 2015
From: ORACLE USA, INC.; SUN MICROSYSTEMS, INC.; ORACLE AMERICA, INC.
To: ORACLE AMERICA, INC.
Reel/Frame 037311/0101 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 16, 2007
From: HOCKANSON, DAVID; NOVAK, ISTVAN; NOUJEIM, LEESA
To: SUN MICROSYSTEMS, INC.
Reel/Frame 019302/0149 →