Organic thin film transistor and method for manufacturing the same
View Patent ↗An organic thin film transistor including a substrate, a gate, a gate insulator, an adhesive layer, a metal nano-particle layer and an organic semiconductor layer is provided. The gate is disposed on the substrate. The gate insulator is disposed on the gate and the substrate. The adhesive layer is disposed on the gate insulator. Besides, the adhesive layer has a hydrophobic surface above the gate and a first hydrophilic surface and a second hydrophilic surface on two sides of the hydrophobic surface. A surface of the metal nano-particle layer is modified by a hydrophilic group, and the metal nano-particle layer is disposed on the first and the second hydrophilic surfaces of the adhesive layer as a source and a drain, respectively. The organic semiconductor layer is disposed on the hydrophobic surface of the adhesive layer and on the metal nano-particle layer.
1. An organic thin film transistor (OTFT), comprising:
a substrate;
a gate disposed on the substrate;
a gate insulator disposed on the substrate and covering the gate, wherein the gate insulator comprises a silicon-containing compound;
an adhesive layer disposed on the gate insulator, wherein the adhesive layer has a hydrophobic surface above the gate and a first hydrophilic surface and a second hydrophilic surface on two sides of the hydrophobic surface, and the adhesive layer is a silane material layer such that a silanization reaction is between the surface of the gate insulator and the silane material layer;
a metal nano-particle layer, a surface thereof being modified by a hydrophilic group, the metal nano-particle layer being disposed on the first and the second hydrophilic surfaces of the adhesive layer as a source and a drain, respectively; and
an organic semiconductor layer disposed on the hydrophobic surface of the adhesive layer and on the metal nano-particle layer.
2. The OTFT of claim 1 , wherein the silane material layer comprises a hydrophobic surface and two hydrophilic surfaces.
3. The OTFT of claim 1 , wherein the adhesive layer is a stacked material layer.
4. The OTFT of claim 3 , wherein the stacked material layer comprises:
a hydrophilic silane material layer disposed on the gate insulator; and
a hydrophobic material layer disposed on the hydrophilic silane material layer above the gate.
5. The OTFT of claim 3 , wherein the stacked material layer comprises:
a hydrophobic silane material layer disposed on the gate insulator; and
a hydrophilic material layer disposed on two sides of the hydrophobic material layer above the gate.
6. The OTFT of claim 1 , wherein the hydrophilic group comprises a hydroxyl group (—OH), an amino group (—NH 2 ), a thiol group (—SH) or a carboxyl group (—COOH).
7. The OTFT of claim 1 , wherein the material of the metal nano-particle layer comprises gold nano-particles, silver nano-particles, palladium nano-particles, or copper nano-particles.
8. The OTFT of claim 1 , wherein the material of the organic semiconductor layer comprises pentacene, poly(9,9-dioctylfluorene co-bithiophene) (F8T2), or poly(thiophene) derivatives.
9. The OTFT of claim 1 , wherein the material of the gate comprises a metal, an alloy of metals, or metal nano-particles.
10. A method of manufacturing an organic thin film transistor (OTFT), comprising:
forming a gate on a substrate;
forming a gate insulator to cover the gate and the substrate, wherein the gate insulator comprises a silicon-containing compound;
forming an adhesive layer on the gate insulator, wherein the adhesive layer has a hydrophobic surface above the gate and a first hydrophilic surface and a second hydrophilic surface on two sides of the hydrophobic surface, and the adhesive layer is a silane material layer such that a silanization reaction is between the surface of the gate insulator and the silane material layer;
forming a metal nano-particle layer having a surface modified by a hydrophilic group, such that the metal nano-particles are selectively attached to the first and the second hydrophilic surfaces as a source and a drain, respectively; and
forming an organic semiconductor layer on the hydrophobic surface of the adhesive layer and on the metal nano-particle layer.
11. The method of claim 10 , wherein
a surface of the silane material layer being characterized by hydrophobic properties; and
performing an illumination treatment to transform a portion of the surface of the silane material layer above two sides of the gate to a hydrophilic surface.
12. The method of claim 10 , wherein the adhesive layer is a stacked material layer.
13. The method of claim 12 , wherein the steps of forming the adhesive layer comprise:
forming a hydrophilic silane material layer on the gate insulator; and
forming a hydrophobic material layer on the hydrophilic silane material layer above the gate.
14. The method of claim 12 , wherein the steps of forming the adhesive layer comprise:
forming a hydrophobic silane material layer on the gate insulator; and
forming a hydrophilic material layer on two sides of the hydrophobic silane material layer above the gate.
15. The method of claim 10 , wherein the hydrophilic group comprises —OH, —NH 2 , —SH or —COOH.
16. The method of claim 10 , wherein the method of forming the metal nano-particle layer comprises performing an ink-jet process or a transfer printing process, such that the metal nano-particles are selectively attached to the first and the second hydrophilic surfaces.
17. The method of claim 10 , wherein the material of the metal nano-particle layer comprises Au nano-particles, Ag nano-particles, Pd nano-particles or Cu nano-particles.
18. The method of claim 10 , wherein the material of the organic semiconductor layer comprises pentacene, poly(9,9-dioctylfluorene co-bithiophene) (F8T2) or poly(thiophene) derivatives.
19. The method of claim 10 , wherein the material of the gate comprises a metal, an alloy of metals, or metal nano-particles.