Packaging system including pallet de-layering system
View Patent ↗A packaging system for handling palletized product arranged in multiple layers of product cases, a pallet de-layering system includes a gripper mechanism. The gripper mechanism is configured to clamp a layer of the multiple layers by applying a clamping force to one or more product cases of the layer such that the layer can be removed from an adjacent layer of product cases to a different location. The layer includes a void between adjacent product cases. The gripper mechanism includes a void filling member carried by the gripper mechanism. The void filling member is sized and located to be positioned within the void to limit movement of the adjacent product cases into the void during a clamping operation.
1. In a packaging system for handling palletized product arranged in multiple layers of product cases, a pallet de-layering system comprising:
a gripper mechanism configured to clamp a layer of the multiple layers by applying a clamping force to one or more product cases of the layer such that the layer can be removed from an adjacent layer of product cases to a different location, the layer including a void between adjacent product cases; and
a void filling member carried by the gripper mechanism, the void filling member being sized and located to be positioned within the void to limit movement of the adjacent product cases into the void during a clamping operation;
wherein multiple, spaced-apart void filling members are carried by the gripper mechanism, each void filling member moveable by an associated actuator between a raised position and a lowered position relative to the gripper mechanism;
at least one sensor for indicating a void location and a controller for controlling each actuator in response to output of the sensor.
2. The pallet de-layering system of claim 1 , wherein the controller raises the void filling member that is not aligned with the void location.
3. The pallet de-layering system of claim 1 , wherein the gripper mechanism includes opposing grippers that are arranged and configured to apply opposing gripping forces to product cases of the layer.
4. A method of handling palletized product arranged in multiple product layers of product cases, where a product layer includes multiple cases arranged such that an interior void is located in the product layer, the method comprising:
providing multiple, spaced-apart void filling members carried by a gripper mechanism, each void filling member moveable by an associated actuator between a raised position and a lowered position relative to the gripper mechanism;
utilizing at least one sensor to identify a location of the void in the product layer and responsively lowering the void filling member aligned with the location in order to place the void filling member in the void of the product layer;
expanding the void filling member from a collapsed configuration to occupy a greater volume within the void thereby limiting movement of product cases into the void during a clamping operation; and
applying an inward clamping force against a perimeter of the product layer using the gripper mechanism such that the product layer can be lifted and carried to a different location.
5. The method of claim 4 further comprising detecting a location of a first edge of the product layer.
6. The method of claim 5 further comprising aligning the gripper mechanism with the product layer based at least in part on the location of the first edge.
7. The method of claim 5 further comprising detecting a location of a second edge of the product layer.
8. The method of claim 4 further comprising providing a mechanical interlock arrangement on the void filling member to prevent the void filling member from moving back to the collapsed configuration when the inward clamping force is being applied.