High density IC module
View Patent ↗A system and method for assembling dual-die integrated circuit packages using thermocompression bonding or thermosonic bonding to bond a second die to a substrate opposite a first die bonded to the substrate. The second die is bonded using heat conducted through the first die to the substrate, and optionally through an underfill material. The first and second die are connected such that bumps are connected to common bonding pads on the substrate. Bumps on one of the die extend through openings in the substrate to connect to the common bonding pads. The bonding pads are within the perimeter of the first die.
1. A dual-die integrated circuit package comprising:
a substrate having first and second opposing substrate surfaces;
a first die bonded to the first substrate surface;
a second die bonded to the second substrate surface at least partly using thermal energy conducted through the first die to the substrate;
further comprising a first set of conductive bumps on the first die and a second set of conductive bumps on the second die substantially aligned with corresponding bonding sites centrally positioned on the substrate; and
wherein the respective conductive bumps on the first die and the second die are connected to the same bonding sites on the substrate, with the conductive bumps of one of the first die and the second die extending through openings formed in the substrate.
2. The package of claim 1 , wherein the corresponding bumps on the first die and second die are positioned within the perimeters of both the first die and the second die.