IP Library Granted Patent US 7,320,551
Granted Patent B1
US 7,320,551 · App. 11/738,369 · Granted Jan 22, 2008

Optoelectronic module classification clip

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Quick Facts
Patent No.
US 7,320,551
App. No.
11/738,369
Granted
Jan 22, 2008
Kind
B1
Abstract

A classification clip for an electronic or optoelectronic module. In one example embodiment, an optoelectronic module classification clip includes a body, a complementary structure attached to the body and configured to engage a complementary structure of a shell of an optoelectronic module, and a visible indicator included on at least a portion of the body or the complementary structure. The visible indicator indicates information concerning a characteristic of the optoelectronic module.

Claims (33)

1. An optoelectronic module classification clip comprising:

a body;

a complementary structure attached to the body and configured to engage a complementary structure of a shell of an optoelectronic module; and

a visible indicator included on at least a portion of the body or the complementary structure attached to the body that indicates information concerning a characteristic of the optoelectronic module.

2. The optoelectronic module classification clip as recited in claim 1 , wherein the optoelectronic module classification clip is a substantially monolithic component.

3. The optoelectronic module classification clip as recited in claim 2 , wherein the optoelectronic module classification clip is formed from one of PS66, Ultem®, polycarbonate, or ABS.

4. The optoelectronic module classification clip as recited in claim 1 , wherein the visible indicator comprises a color included on the body or the complementary structure.

5. The optoelectronic module classification clip as recited in claim 1 , wherein the visible indicator comprises characters included on the body or the complementary structure.

6. The optoelectronic module classification clip as recited in claim 1 , wherein the characteristic of the optoelectronic module includes one of data rate, wavelength, communication protocol, form factor, manufacturer, or vendor of the optoelectronic module.

7. The optoelectronic module classification clip as recited in claim 1 , wherein the visible indicator further indicates information concerning one or more additional characteristics of the optoelectronic module.

8. An optoelectronic module classification clip comprising:

a base;

a pair of arms extending from the base, each arm configured to engage a complementary structure of a shell of an optoelectronic module, at least a portion of the base or one of the arms having a color that corresponds to a wavelength associated with the optoelectronic module; and

a protrusion extending from each arm, the protrusion configured to be received by a complementary cavity defined by the shell of the optoelectronic module.

9. The optoelectronic module classification clip as recited in claim 8 , wherein the optoelectronic module classification clip is a substantially monolithic component.

10. The optoelectronic module classification clip as recited in claim 9 , wherein the optoelectronic module classification clip comprises one of PA66, Ultem®, polycarbonate, or ABS.

11. The optoelectronic module classification clip as recited in claim 8 , further comprising an additional visible indicator that corresponds to information concerning an additional characteristic of the optoelectronic module.

12. The optoelectronic module classification clip as recited in claim 11 , wherein the additional characteristic of the optoelectronic module includes one of data rate, communication protocol, form factor, manufacturer, or vendor of the optoelectronic module.

13. An optoelectronic module comprising:

a shell;

a transmit port defined in the shell;

a receive port defined in the shell; and

a classification clip comprising:

a body;

an complementary structure attached to the body and engaged with a complementary structure of the shell; and

a visible indicator included on at least a portion of the body or the complementary structure attached to the body that indicates information concerning one or more characteristics of the optoelectronic module.

14. The optoelectronic module as recited in claim 13 , wherein the classification clip is a substantially monolithic component.

15. The optoelectronic module as recited in claim 14 , wherein the classification clip is formed from one of PS66, Ultem®, polycarbonate, or ABS.

16. The optoelectronic module as recited in claim 13 , wherein the visible indicator comprises color included on the body or the complementary structure.

17. The optoelectronic module as recited in claim 13 , wherein the characteristic of the optoelectronic module includes one of data rate, wavelength, communication protocol, form factor, manufacturer, or vendor of the optoelectronic module.

18. The optoelectronic module as recited in claim 13 , wherein the visible indicator further indicates information concerning one or more additional characteristics of the optoelectronic module.

19. The optoelectronic module as recited in claim 13 , wherein the optoelectronic module is substantially compliant with the SFP+ (IPF) MSA.

20. The optoelectronic module as recited in claim 13 , wherein the complementary structure attached to the body is engaged with the complementary structure of the shell such that the body is positioned above transmit and receive ports and functions as a stop for clips of optical connectors when the optical connectors are positioned within the transmit and receive ports.

Assignments (5)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2007
From: MOORE, JOSHUA; KIM, DAEHWAN DANIEL
To: FINISAR CORPORATION
Reel/Frame 019346/0709 →