Method for manufacturing semiconductor integrated circuit device
View Patent ↗In a process of forming MISFETs that have gate insulating films that are mutually different in thickness on the same substrate, the formation of an undesirable natural oxide film at the interface between the semiconductor substrate and the gate insulating film is suppressed. A gate insulating film of MISFETs constituting an internal circuit is comprised of a silicon oxynitride film. Another gate insulating film of MISFETs constituting an I/O circuit is comprised of a laminated silicon oxynitride film and a high dielectric film. A process of forming the two types of gate insulating films on the substrate is continuously carried out in a treatment apparatus of a multi-chamber system. Accordingly, the substrate will not be exposed to air. Therefore, it is possible to suppress the inclusion of undesirable foreign matter and the formation of a natural oxide film at the interface between the substrate and the gate insulating films.
1. A semiconductor device comprising:
a semiconductor substrate; and
a first MISFET and a second MISFET formed over the substrate,
the first MISFET having a first gate insulating film and a first gate electrode formed over the first gate insulating film,
the second MISFET having a second gate insulating film and a second gate electrode formed over the second gate insulating film,
wherein a thickness of the second gate insulating film is greater than a thickness of the first gate insulating film,
wherein the second gate insulating film includes a first insulating film formed over the semiconductor substrate and a second insulating film formed between the first insulating film and the second gate electrode,
wherein the second insulating film includes hafnium and oxygen and has a dielectric constant larger than that of the first insulating film,
wherein the first insulating film includes a silicon oxide film subjected to a nitriding treatment,
wherein the first gate insulating film includes the second insulating film formed between the semiconductor substrate and the first gate electrode, and
wherein each of the first gate electrode and the second gate electrode includes a refractory metal film.
2. A semiconductor device according to claim 1 ,
wherein a first side spacer is formed on a side surface of the first gate electrode and includes a silicon nitride film, and
wherein a second side spacer is formed on a side surface of the second gate electrode and includes a silicon nitride film.
3. A semiconductor device according to claim 1 ,
wherein the second insulating film is subjected to a nitriding treatment.
4. A semiconductor device according to claim 1 ,
wherein a third insulating film is formed between the semiconductor substrate and the second insulating film, and
wherein the third insulating film is formed by oxidizing the substrate.
5. A semiconductor device according to claim 4 , wherein the thickness of the first insulating film is greater than the thickness of the third insulating film.
6. A semiconductor device according to claim 1 ,
wherein the refractory metal film is a tungsten film.
7. A semiconductor device comprising:
a semiconductor substrate; and
a first MISFET and a second MISFET formed over the substrate,
the first MISFET having a first gate insulating film and a first gate electrode formed over the first gate insulating film,
the second MISFET having a second gate insulating film and a second gate electrode formed over the second gate insulating film,
an interlayer insulating film formed over the first MISFET and the second MISFET and having a plurality of grooves,
wherein a thickness of the second gate insulating film is greater than a thickness of the first gate insulating film,
wherein the second gate insulating film includes a first insulating film formed over the semiconductor substrate and a second insulating film formed between the first insulating film and the second gate electrode,
wherein the second insulating film includes hafnium and oxygen and has a dielectric constant larger than that of the first insulating film,
wherein the first insulating film includes a silicon oxide film subjected to a nitriding treatment,
wherein the first gate insulating film includes the second insulating film formed between the semiconductor substrate and the first gate electrode,
wherein the second insulating films of the first MISFET and the second MISFET are formed over the side wall of the grooves and over the semiconductor substrate, providing grooves of the second insulating films, and
wherein each of the first gate electrode and the second gate electrode includes a refractory metal film and is embedded into the grooves of the second insulating films.
8. A semiconductor device according to claim 7 ,
wherein a first side spacer is provided on a side surface of the first gate electrode and includes a silicon nitride film, and
wherein a second side spacer is provided on a side surface of the second gate electrode and includes a silicon nitride film.
9. A semiconductor device according to claim 7 ,
wherein the second insulating film is subjected to a nitriding treatment.
10. A semiconductor device according to claim 7 ,
wherein a third insulating film is formed between the semiconductor substrate and the second insulating film, and
wherein the third insulating film is formed by oxidizing the substrate.
11. A semiconductor device according to claim 10 , wherein the thickness of the first insulating film is greater than the thickness of the third insulating film.
12. A semiconductor device according to claim 7 ,
wherein the refractory metal film is a tungsten film.