Method for thermal seaming of polyimides
View Patent ↗The present invention is a method for seaming a polyimide material. The method involves forming an interface between multiple the polyimide materials. Next, heat is applied to the interface to soften the polyimide material. The temperature of the heat source is below the melting point of the polyimide material. Finally, pressure is applied to the interface to create a seam between the polyimide materials.
1. A method for seaming a polyimide material to a second material, comprising:
forming an interface between the polyimide material and the second material, where the second material is different than the polyimide material;
applying heat to the interface to soften the polyimide material and the second material, where the heat is above the glass transition temperature of the polyimide material and the second material;
applying pressure to the interface such that molecules of the polyimide material and the second material diffuse across the interface; and
applying a reflective coating to at least one of the polyimide material and the second material.
2. The method of claim 1 , where the second material comprises a different polyimide material.
3. The method of claim 1 , where the second material comprises a polyamide imide.