Method of fabricating a printhead integrated circuit attachment film

1. A method of fabricating a film for attachment of one or more printhead integrated circuits to an ink supply manifold, said method comprising the steps of:

(a) providing an adhesive polymeric film having at least one protective liner;

(b) depositing photoresist onto the protective liner;

(c) photopatterning said photoresist to define a plurality of openings positioned for etching supply holes through said adhesive polymeric film;

(d) etching the plurality of ink supply holes through said protective liner and said adhesive polymeric film, said photoresist on said protective liner acting as a mask for said etch; and

(e) removing the protective liner from said adhesive polymeric film, including said photoresist, after said etching step is complete, thereby providing said adhesive polymeric film for attachment of one or more printhead integrated circuits to an ink supply manifold.

2. The method of claim 1 , wherein said adhesive polymeric film comprises a central polymeric web sandwiched between adhesive layers.

3. The method of claim 2 , wherein said adhesive layers are thermally-curable adhesive layers.

4. The method of claim 2 , wherein said adhesive polymeric film has two protective liners, each protecting a respective adhesive layer.

5. The method of claim 1 , wherein said ink supply holes are etched by wet-etching.

6. The method of claim 1 further comprising the step of:

(f) replacing said at least one protective liner with a replacement liner.

7. The method of claim 4 , wherein one of said protective liners has said photoresist deposited thereon.

8. The method of claim 4 , further comprising the step of:

(f) replacing each protective liner with a replacement liner.

9. The method of claim 6 , further comprising winding said film onto a reel for storage prior to printhead assembly.

10. The method of claim 1 , wherein step (e) is performed by peeling said liner away from said adhesive layer.

11. The method of claim 1 , wherein said ink supply holes have a length dimension of up to about 500 microns and a width dimension of up to about 500 microns.

12. The method of claim 1 , wherein said ink supply holes are substantially free of carbonaceous soot deposits.

13. A method of attaching one or more printhead integrated circuits onto an ink supply manifold, said method comprising the steps of:

(a) providing an adhesive polymeric film having at least one protective liner;

(b) depositing photoresist onto the protective liner;

(c) photopatterning said photoresist to define a plurality of openings positioned for etching supply holes through said adhesive polymeric film;

(d) etching the plurality of ink supply holes through said protective liner and said adhesive polymeric film, said photoresist on said protective liner acting as a mask for said etching step;

(e) removing the protective liner from said adhesive polymeric film, including said photoresist, after said etching step is complete;

(f) attaching said ink supply manifold to said adhesive polymeric film; and

(g) attaching said one or more printhead integrated circuits to said adhesive polymeric film.

14. The method of claim 13 , wherein said ink supply manifold is an LCP molding.

15. The method of claim 13 , wherein a plurality of said printhead integrated circuits are attached to said ink supply manifold such that they are butted end on end to provide a pagewidth printhead.

16. The method of claim 13 , wherein said ink supply holes are positioned to supply ink to ink supply channels defined in a backside of said at least one printhead integrated circuit.

17. The method of claim 13 , wherein said attaching steps are performed by thermal curing and/or compression.

18. The method of claim 13 , wherein said ink supply holes are substantially free of carbonaceous soot deposits.