Solderable Plastic EMI Shielding
An electromagnetic interference shield includes a polymer thin film metalized with conductive metals and a solderable material deposited over the conductive metals. The solderable material has a low melting temperature so that the solder can be heated to form a weld joint between a chip (or component) and the solder without damaging the metalized polymer thin film. One example of a low melting temperature solder is SnBi.
1 . A system for shielding electronic devices, comprising:
a polymer thin film metalized with a conductive metal; and
a layer made of solderable material deposited over said conductive layer.
2 . The system of claim 1 wherein said layer made of solderable material is the final layer deposited onto the system for shielding electronic devices.
3 . The system of claim 1 wherein said conductive layer is selected from the group consisting of aluminum, tin and gold.
4 . The system of claim 1 wherein said polymer thin film comprises polyethermide.
5 . The system of claim 1 wherein said polymer thin film comprises polyetheretherketone.
6 . The system of claim 1 wherein said layer made of solderable material comprises SnBi.
7 . The system of claim 1 wherein said layer made of solderable material is a low-melt temperature material.
8 . The system of claim 1 wherein said polymer thin film comprises rib structure.
9 . The system of claim 1 wherein said polymer thin film is less then 5 mils thick and said polymer thin film comprises a rib structure.
10 . The system of claim 1 wherein said polymer thin film has a heat distortion temperature of greater than 150° C.
11 . A system for shielding electronic devices, comprising:
a polymer thin film; and
a layer made of solderable material deposited over said polymer thin film.
12 . The system of claim 11 wherein said polymer thin film comprises polyethermide.
13 . The system of claim 11 wherein said polymer thin film comprises polyetheretherketone.
14 . The system of claim 11 wherein said layer made of solderable material comprises SnBi.
15 . The system of claim 11 wherein said layer made of solderable material is a low-melt temperature material.
16 . The system of claim 11 wherein said polymer thin film comprises rib structure.
17 . The system of claim 11 wherein said polymer thin film is less then 5 mils thick and said polymer thin film comprises a rib structure.
18 . The system of claim 11 wherein said polymer thin film has a heat distortion temperature of greater than 150° C.
19 . A method for making an EMI shield for shielding electronic devices, comprising:
metalizing a polymer thin film with a conductive metal; and
depositing a layer made of solderable material over said conductive layer.
20 . The method of claim 19 wherein said step of depositing a layer made of solderable material over said conductive layer comprises sputtering said solderable material onto said conductive layer.
21 . The method of claim 19 wherein said step of depositing a layer made of solderable material over said conductive layer comprises using thermal evaporation to deposit said layer over said conductive layer.
22 . The method of claim 19 wherein said step of depositing a layer made of solderable material over said conductive layer comprises electroplating said solderable material onto said conductive layer.
23 . The method of claim 19 wherein said layer made of solderable material is deposited directly onto said conductive layer.
24 . A method for making an EMI shield for shielding electronic devices, comprising:
providing a polymer thin film; and
depositing a layer made of solderable material over said polymer thin film.
25 . The method of claim 24 wherein said step of depositing a layer made of solderable material over said polymer thin film comprises sputtering said solderable material onto said polymer thin film.
26 . The method of claim 24 wherein said step of depositing a layer made of solderable material over said polymer thin film comprises using thermal evaporation to deposit said layer made of solderable material over said polymer thin film.
27 . The method of claim 24 wherein said step of depositing a layer made of solderable material over said polymer thin film comprises electroplating said solderable material onto said polymer thin film.
28 . The method of claim 24 wherein said layer made of solderable material is deposited directly onto said conductive layer.