IP Library Granted Patent US 7,800,684
Granted Patent B2
US 7,800,684 · App. 11/745,723 · Granted Sep 21, 2010

Solid-state image pickup device and image pickup apparatus with a low reflective film on the substrate

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Quick Facts
Patent No.
US 7,800,684
App. No.
11/745,723
Granted
Sep 21, 2010
Kind
B2
Abstract

A solid-state image pickup device includes a semiconductor substrate 11 , a photoelectric-conversion sensor portion 13 formed on the surface of the semiconductor substrate 11 , a pixel area including an effective pixel portion 31 and an optical black portion 32 and a low reflective film 21 with low reflectance of infrared light formed on the back of the substrate 11 . The solid-state image pickup device has satisfactory image pickup characteristics by suppressing an optical black optical level of the optical black portion from being fluctuated due to incidence of infrared light.

Claims (18)

1. A solid-state image pickup device comprising:

a semiconductor substrate;

a photoelectric-conversion sensor portion on the surface of said semiconductor substrate;

a pixel area including an effective pixel portion and an optical black portion; and

a low reflective film with low reflectance of infrared light on the back of said semiconductor substrate,

wherein,

said low reflective film is effective to cause interference between a first light reflected on the back of said semiconductor substrate and a second light reflected through said low reflected film thereby weakening the intensities of the first and second light.

2. A solid-state image pickup device according to claim 1 , wherein said low reflective film is a multilayer film formed by laminating a plurality of films, each of which has a larger difference of refractive index.

3. A solid-state image pickup device according to claim 1 , wherein said low reflective film is SiN, SiO 2 , polycrystalline silicon, or Ta 2 O 3 and said low reflective film is effective to absorb infrared light.

4. An image pickup apparatus comprising:

a solid-state image pickup device; and

an optical component for introducing incident light into said solid-state image pickup device, said solid-state image pickup device including:

a semiconductor substrate;

a photoelectric-conversion sensor portion on the surface of said semiconductor substrate;

a pixel area including an effective pixel portion and an optical black portion; and

a low reflective film with low reflectance of infrared light on the back of said semiconductor substrate,

wherein,

said low reflective film is effective to cause interference between a first light reflected on the back of said semiconductor substrate and a second light reflected through said low reflected film thereby weakening, the intensities of the first and second light.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 19, 2016
From: SONY CORPORATION
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 040419/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 9, 2007
From: TATANI, KEIJI
To: SONY CORPORATION
Reel/Frame 019268/0102 →