Super-thin OLED and method for manufacturing the same
View Patent ↗A flat panel display includes a glass substrate, an organic light-emitting part, and a sealing part. The organic light-emitting part includes one or more organic light-emitting devices (OLED) formed on a surface of the glass substrate, which has a thickness of about 0.05 mm to about 0.5 mm. The sealing part seals the organic light-emitting part and protects it from damage during the manufacturing process. A method for manufacturing the flat panel display includes preparing a glass substrate of approximately 0.7 mm thickness or greater; forming a plurality of organic light-emitting devices on a surface of the glass substrate, wherein a group of one or more of the plurality of organic light-emitting devices constitutes an organic light-emitting part; sealing each organic light-emitting part; and etching the glass substrate to a predetermined thickness.
1. A method for manufacturing a flat panel display, comprising:
forming a plurality of organic light-emitting parts on a surface of a glass substrate, wherein each organic light-emitting part comprises a grouping of one or more of a plurality of organic light-emitting devices;
sealing each organic light-emitting part;
bonding a sealing glass substrate to the glass substrate by a sealing material, wherein the sealing material surrounds all of the organic light-emitting parts and forms a single closed loop around all of the organic light-emitting parts;
etching the glass substrate; and
cutting the glass substrate and the sealing glass substrate at cut points, wherein the cut points are between the organic light-emitting parts and the sealing material, and the sealing glass is thereby removed from each organic light-emitting part.
2. The method of claim 1 , wherein sealing each organic light-emitting part further comprises:
sealing each organic light-emitting part using a sealing film.
3. The method of claim 1 , wherein sealing each organic light-emitting part further comprises:
sealing each organic light-emitting part using a resin material.
4. The method of claim 3 , further comprising:
removing the resin material after etching the glass substrate.
5. The method of claim 1 , wherein sealing each organic light-emitting part further comprises:
depositing about each organic light-emitting part, a barrier layer to seal each organic light-emitting part; and
forming at least a polymer layer on the barrier layer.
6. The method of claim 5 , wherein the barrier layer is formed of at least one of a material selected from the group consisting of silicon, metal oxide, metal nitride, metal carbide, metal oxynitride, and a compound of these materials.
7. The method of claim 5 , wherein the polymer layer is formed of at least one of a material selected from the group consisting of an organic polymer, an inorganic polymer, an organometallic polymer, and a hybrid organic/inorganic polymer.
8. The method of claim 1 , wherein the glass substrate is etched to a thickness of about 0.05 mm to about 0.5 mm.
9. A method for manufacturing a flat panel display, comprising:
forming a plurality of organic light-emitting parts on a surface of a glass substrate, wherein each organic light-emitting part comprises a grouping of one or more of a plurality of organic light-emitting devices;
sealing each organic light-emitting part using a resin material;
bonding a sealing glass substrate to the glass substrate by a sealing material, wherein the sealing material surrounds the organic light-emitting parts;
etching the glass substrate;
cutting the glass substrate and the sealing glass substrate at cut points, wherein the cut points are between the organic light-emitting parts; and
removing the resin material after etching the glass substrate.
10. A method for manufacturing a flat panel display, comprising:
forming a plurality of organic light-emitting parts on a surface of a glass substrate, wherein each organic light-emitting part comprises a grouping of one or more of a plurality of organic light-emitting devices;
sealing each organic light-emitting part;
bonding a first sealing film substrate to the glass substrate by a sealing material, wherein the sealing material surrounds all of the organic light-emitting parts and forms a single closed loop around all of the organic light-emitting parts;
etching the glass substrate; and
cutting the glass substrate and the first sealing film substrate at cut points, wherein the cut points are between the organic light-emitting parts and the sealing material thereby the first sealing film is removed from each organic light-emitting part.
11. The method of claim 10 , wherein sealing each organic light-emitting part further comprises:
sealing each organic light-emitting part using a second sealing film.
12. The method of claim 10 , wherein sealing each organic light-emitting part further comprises:
sealing each organic light-emitting part using a resin material.
13. The method of claim 12 , further comprising:
removing the resin material after etching the glass substrate.
14. The method of claim 10 , wherein sealing each organic light-emitting part further comprises:
depositing about each organic light-emitting part, a barrier layer to seal each organic light-emitting part; and
forming at least a polymer layer on the barrier layer.
15. The method of claim 14 , wherein the barrier layer is formed of at least one of a material selected from the group consisting of silicon, metal oxide, metal nitride, metal carbide, metal oxynitride, and a compound of these materials.
16. The method of claim 14 , wherein the polymer layer is formed of at least a material selected from the group consisting of an organic polymer, an inorganic polymer, an organometallic polymer, and a hybrid organic/inorganic polymer.
17. The method of claim 10 , wherein the glass substrate is etched to a thickness of about 0.05 mm to about 0.5 mm.