IP Library Granted Patent US 8,018,316
Granted Patent B2
US 8,018,316 · App. 11/747,555 · Granted Sep 13, 2011

Electroless plating production of nickel and cobalt structures

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Quick Facts
Patent No.
US 8,018,316
App. No.
11/747,555
Granted
Sep 13, 2011
Kind
B2
Abstract

A method comprising forming a structural element 115 on a surface 620 of a layer 510 via an electroless plating of nickel or cobalt 130 onto the surface, the layer being rigidly fixed to an underlying substrate 110 . The method also comprises etching away a portion of the layer such that a part of the structural element is able to move with respect to the substrate.

Claims (21)

1. An apparatus, comprising:

a substrate having a surface; and

a MEMS device including a structural element having a first part that is rigidly fixed to said surface, and a second part that is movable with respect to said substrate, wherein

said structural element is a separately moveable monolayer of nickel or cobalt alloyed with phosphorus or boron and having a substantially amorphous structure, and said first part and said second part are different portions of a single continuous piece of said monolayer.

2. The apparatus of claim 1 , wherein said nickel or cobalt alloy has a yield point that is within about 55 percent of said nickel or cobalt alloy's ultimate tensile strength.

3. The apparatus of claim 1 , wherein a surface of said structural element further comprises a metal seed layer thereon, wherein said seed layer is free of phosphorus or boron.

4. The apparatus of claim 1 , wherein said structural element consists essentially of said nickel or said cobalt alloyed with said phosphorus or said boron.

5. The apparatus of claim 1 , wherein said structural element is composed of at least about 99 wt % said nickel or said cobalt alloyed with said phosphorus or said boron.

6. The apparatus of claim 1 , wherein said second part is configured to reversibly deform when an actuating current is applied through said structural element.

7. The apparatus of claim 1 , wherein said second part includes a first beam and a second beam, wherein said first beam is parallel to said second beam and said second beam is configured to thermally expand to a greater extent than said first beam when an actuating current is applied through said structural element.

8. The apparatus of claim 7 , wherein a width of said first beam is about two times or greater than a width said second beam.

9. The apparatus of claim 1 , wherein said second part of said structural element includes a flexible beam.

10. The apparatus of claim 1 , wherein said second part of said structural element includes a first flexible beam and a second flexible beam.

11. The apparatus of claim 1 , wherein said structural element forms one contact of an electrical switch.

12. An apparatus comprising:

a substrate having a surface; and

a MEMS device including a structural element having a first part that is rigidly fixed to said surface, and a second part that is movable with respect to said substrate, wherein

said first part and said second part are different portions of a single continuous piece formed of nickel or cobalt alloyed with phosphorus or boron and having a substantially amorphous structure, and further including:

a voltage source electrically coupled to said structural element;

a transmitter and a receiver electrically coupled to a second structural element, wherein said transmitter is configured to transmit a signal to said receiver through one or both of said structural element and said second structural element when one or both of said structural element and said second structural element are actuated to contact each other, and wherein

said MEMS device is configured as a microelectromechanical thermal relay and further includes said second structural element on said substrate and adjacent to, but electrically isolated from, said structural element when said MEMS device is not actuated.

Assignments (14)
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Jan 22, 2025
From: CACI LGS INNOVATIONS LLC
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 069987/0444 →
CHANGE OF NAME Recorded Nov 4, 2024
From: LGS INNOVATIONS LLC
To: CACI LGS INNOVATIONS LLC
Reel/Frame 069292/0770 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded May 29, 2019
From: LGS INNOVATIONS LLC
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 049312/0843 →
RELEASE OF SECURITY INTEREST Recorded May 21, 2019
From: BANK OF AMERICA, N.A.
To: LGS INNOVATIONS LLC
Reel/Frame 049247/0557 →
RELEASE OF SECURITY INTEREST Recorded May 2, 2019
From: BANK OF AMERICA, N.A.
To: LGS INNOVATIONS LLC
Reel/Frame 049074/0094 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Jul 19, 2017
From: LGS INNOVATIONS LLC
To: BANK OF AMERICA, N.A.
Reel/Frame 043254/0393 →
RELEASE OF SECURITY INTEREST Recorded Sep 30, 2014
From: CREDIT SUISSE AG
To: ALCATEL LUCENT
Reel/Frame 033868/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 23, 2014
From: ALCATEL LUCENT
To: LGS INNOVATIONS LLC
Reel/Frame 032743/0584 →
RELEASE OF SECURITY INTEREST Recorded Apr 1, 2014
From: CREDIT SUISSE AG
To: ALCATEL LUCENT
Reel/Frame 032578/0952 →
SECURITY INTEREST Recorded Apr 1, 2014
From: LGS INNOVATIONS LLC
To: BANK OF AMERICA NA
Reel/Frame 032579/0066 →
SECURITY AGREEMENT Recorded Jan 30, 2013
From: ALCATEL LUCENT
To: CREDIT SUISSE AG
Reel/Frame 029821/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 26, 2011
From: ALCATEL-LUCENT USA INC.
To: ALCATEL LUCENT
Reel/Frame 026647/0132 →
MERGER Recorded Jul 18, 2011
From: LUCENT TECHNOLOGIES INC.
To: ALCATEL-LUCENT USA INC.
Reel/Frame 026604/0096 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 11, 2007
From: PARDO, FLAVIO; SIMON, MARIA E.; VYAS, BRIJESH; XU, CHEN
To: LUCENT TECHNOLOGIES INC.
Reel/Frame 019282/0712 →