IP Library Granted Patent US 8,377,389
Granted Patent B2
US 8,377,389 · App. 11/748,140 · Granted Feb 19, 2013

Microfluidic circuit

Inventor: Shun Momose (Kyoto, JP)
Assignee: Rohm Co., Ltd.
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Quick Facts
Patent No.
US 8,377,389
App. No.
11/748,140
Granted
Feb 19, 2013
Kind
B2
Abstract

A fabrication method of a microfluidic circuit is provided, dispensable of mask registration, absent of deviation in mask positioning, and inexpensive in fabrication cost. The fabrication method of a microfluidic circuit has a light transmissive substrate stacked on a light absorptive substrate, and the light transmissive substrate welded with the light absorptive substrate for bonding by directing light through the light transmissive substrate. The microfluidic circuit includes a microchannel at the bottom face of the light transmissive substrate and/or at the top face of the light absorptive substrate. The method includes the step of forming, at the light transmissive substrate, a light attenuation region attenuating transmittance of light towards the microchannel when light is directed through the light transmissive substrate.

Claims (11)

1. A microfluidic circuit comprising:

a light, absorptive substrate,

a light transmissive substrate stacked on said light absorptive substrate, wherein said light transmissive substrate has a thickness d and a refraction index n, and

a microchannel at a bottom face of said light transmissive substrate, wherein the microchannel has a width w, and wherein a value of (d/w)tan [90−θ−sin −1 {(sin(90−θ))/n}] is at least 0.1, where θ is an incident angle of directed light transmitted to said microchannel,

wherein the light transmissive substrate is welded with the light absorptive substrate for bonding by directing light through the light transmissive substrate,

wherein said light transmissive substrate includes a light attenuation region that includes a cavity having a face that is not perpendicular to the directed light and the attenuates an amount of transmitted light to said microchannel by random reflection when light is directed through said light transmissive substrate,

wherein the light attenuation region at the light transmissive substrate contains a light blocking material composed of carbon black, and

wherein the microchannel does not have heat deformation.

2. The microfluidic circuit according to claim 1 , wherein the amount of transmitted light at said microchannel is attenuated, by said light attenuation region, to not more than 80% of an amount of directed light to said light transmissive substrate.

3. The microfluidic circuit according to claim 1 , wherein said light attenuation region at said light transmissive substrate includes a surface having an arithmetical mean roughness Ra of 1 μm to 50 μm.

4. The microfluid circuit according to claim 1 , wherein the light transmissive substrate is composed of thermoplastic resin.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 1, 2019
From: ROHM CO., LTD.
To: HORIBA, LTD.
Reel/Frame 049049/0016 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 17, 2007
From: MOMOSE, SHUN
To: ROHM CO., LTD.
Reel/Frame 019563/0820 →
Priority Claims (1)
JP 2006-136783 · May 16, 2006 · national
Continuity (1)
Related Publication 20070277927A1 · Dec 6, 2007