Granted Patent B1

US 7,432,187 · App. 11/748,150 · Granted Oct 7, 2008

Abstract

Claims (38)

1. A method for improving current distribution of a transparent electrode, comprising the steps of:

a) forming a transparent electrode over a substrate;

b1) forming a first mask;

b2) forming a plurality of first openings in the first mask;

c) locating the first mask over the transparent electrode;

d) forming a dispersion including conductive precursor components;

e) depositing the dispersion over the first mask and through the first openings onto the transparent electrode;

f) removing the first mask; and

g) curing the conductive precursor components of the dispersion to form first patterned conductive areas having a first thickness on the transparent electrode.

2. The method of claim 1 , further comprising the steps of:

h) locating a second mask over the transparent electrode to expose second openings over the transparent electrode differently located than the first openings;

i) depositing the dispersion over the second mask and through the second openings onto the transparent electrode;

j) removing the second mask; and

k) curing the dispersion to form second patterned conductive areas on the transparent electrode.

3. The method of claim 1 , further comprising the steps of:

h) re-positioning the first mask over the transparent electrode;

i) depositing the dispersion over the first mask and through the first openings onto the transparent electrode;

j) removing the first mask; and

k) curing the dispersion to form a third patterned conductive areas on the transparent electrode.

4. The method of claim 1 , further comprising the steps of:

h) depositing the dispersion again over the first mask and through the first openings onto the transparent electrode; and

i) curing the dispersion to form first patterned conductive areas on the transparent electrode having a second thickness greater than the first thickness.

5. The method of claim 1 , wherein the dispersion is deposited over the first mask.

6. The method of claim 1 , wherein the dispersion is deposited over the first openings and environs of the first openings.

7. The method of claim 1 , wherein the dispersion is deposited using hopper, slide, inkjet, or spray deposition.

8. The method of claim 1 , further comprising the steps of forming an additional electrode and a light-emissive layer between the additional electrode and the transparent electrode.

9. The method of claim 8 , wherein the light-emissive layer comprises inorganic materials.

10. The method of claim 9 , wherein the inorganic materials include core/shell quantum dots in a polycrystalline semiconductor matrix.

11. The method of claim 8 , wherein the light-emissive layer comprises organic materials.

12. The method of claim 1 , wherein the dispersion is cured by exposure to heat or light.

13. The method of claim 1 , wherein the dispersion is cured by pattern-wise exposure to a laser beam.

14. The method of claim 1 , wherein the dispersion is cured by exposure to an unpatterned beam of light.

15. The method of claim 1 , wherein the dispersion is repetitively deposited through the first mask.

16. The method of claim 1 , wherein the mask is a metal mask or a polymer mask.

17. The method of claim 1 , wherein the openings in the first mask are formed after locating the mask over the transparent electrode.

18. The method of claim 1 , wherein the dispersion is cured in the openings before the first mask is removed.

19. The method of claim 1 , wherein the openings in the mask are patterned by ablating or melting portions of the mask with laser light.

20. The method of claim 1 , wherein the precursor components of the dispersion include nanoparticles of a conductive material.

Assignments (8)