Cooling structure for interface card
A cooling structure for interface card for cooling the heating component on an interface card includes a heat sink, a metallic hood, and a water block, wherein the heat sink has a heat conducting seat and a plurality of cooling fins, while the heat conducting seat is attached to the heating component of the interface card. Furthermore, the metallic hood arranged on the heat sink is connected thereto. Finally, the water block is arranged on the metallic hood; thereby, the operational heat, generated from the heating element, is absorbed by the heat-conducting seat and is then conducted to the fins of the heat sink, so that the operational heat is distributed to the metallic hood by heat conducting process, making the operational heat that is generated by the heating component carried away through the heat exchanging function of the water block, and thus a desired cooling effectiveness is achieved.
1. A cooling structure for interface card, for reducing the high temperature generated by a heating component of a interface card, comprising:
a heat sink, having a heat conducting seat and a plurality of cooling fins formed thereon, the heat conducting seat being attached onto the heating component;
a metallic hood, arranged over the interface card, enclosing the entire heat sink, and inter-attached with the plurality of cooling fins of the heat sink; and
a water block, attached to outside of the metallic hood, and having a water inlet and a water outlet, for provision of coolant flowing in and flowing out the water block.
2. The cooling structure for interface card according to claim 1 , wherein the heat sink is an aluminum extrusion-molded heat sink.
3. The cooling structure for interface card according to claim 1 , wherein a cooling flow path is formed between any two adjacent cooling fins of the heat sink.
4. The cooling structure for interface card according to claim 1 , wherein a heat conducting medium is arranged between the heat sink 1 and the metallic hood.
5. The cooling structure for interface card according to claim 4 , wherein the heat conducting medium is a solder paste.
6. The cooling structure for interface card according to claim 4 , wherein the heat conducting medium is a thermal conductive paste.
7. The cooling structure for interface card according to claim 1 , wherein the metallic hood is formed as a reverse-U shape.
8. The cooling structure for interface card according to claim 1 , wherein one opening is arranged at each of two sides of the metallic hood.
9. The cooling structure for interface card according to claim 8 , further including a fan, arranged at one opening of the metallic hood.
10. The cooling structure for interface card according to claim 9 , wherein an air flowing direction of the fan is parallel to a cooling flow path formed between any two adjacent cooling fins of the heat sink.
11. The cooling structure for interface card according to claim 1 , wherein a position of the water block is corresponding to that of the heat sink.