Cooling device for interface card
A cooling device for interface card for cooling a heating component on an interface card includes a heat sink and a water cooling head, wherein the heat sink has a heat conducting seat and a plurality of cooling fins. A cooling flow path is formed between any two adjacent cooling fins. In addition, the water block is attached onto the plural cooling fins of the heat sink. Thereby, the operational heat, generated from the heating element, is firstly absorbed by the heat-conducting seat and is then distributed uniformly cross to the plural fins. In addition to the heat dissipation proceeded between the fins and the ambient air, the operational heat is further conducted to the water block, undergoing a heat exchange with the coolant flowing in the water block, and thus a desired cooling effectiveness is achieved.
1. A cooling device for interface card, for reducing the high temperature generated by a heating component of an interface card, comprising:
a heat sink, having a heat conducting seat and a plurality of cooling fins formed thereon, the heat conducting seat being attached onto the heating component;
a water block, attached to the heat sink, and having a water inlet and a water outlet, for provision of coolant flowing in and flowing out the water block; and
a hood, which is connected to the interface card and houses the heat sink therein, and on top of which a through groove, corresponding to a position of the heat sink, is arranged in a way, such that the plurality of cooling fins are just explored out the through groove.
2. The cooling device for interface card according to claim 1 , wherein the heat sink is an aluminum extrusion-molded heat sink.
3. The cooling device for interface card according to claim 1 , wherein a cooling flow path is respectively formed between any two adjacent cooling fins of the heat sink.
4. The cooling device for interface card according to claim 1 , wherein a heat conducting medium is arranged between the heat sink and the water block.
5. The cooling device for interface card according to claim 4 , wherein the heat conducting medium is a solder paste.
6. The cooling device for interface card according to claim 4 , wherein the heat conducting medium is a thermal conductive paste.
7. The cooling device for interface card according to claim 1 , wherein two openings are respectively arranged at two sides of the hood.
8. The cooling device for interface card according to claim 7 , further including a fan, arranged at one opening of the hood.
9. The cooling device for interface card according to claim 8 , wherein an air flowing direction of the fan is parallel to the cooling flow path of the heat sink.