IP Library Patent Application 11751190
Patent Application
App. No. 11/751,190

TOUCH PANEL

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Quick Facts
Patent No.
US None
App. No.
11/751,190
Abstract

A touch panel that sandwiches a light transmitting piezoelectric material, which generates a voltage by a pressing force, between an upper conductive layer formed on a bottom face of an upper substrate and a lower conductive layer formed on a top face of a lower substrate. Since there is no space between the upper conductive layer and the lower conductive layer, reflection of external light can be reduced. This achieves good viewability. In addition, the touch panel can be easily manufactureable just by sequentially superimposing and attaching components

Claims (12)

1 . A touch panel comprising:

a light transmitting upper substrate where an upper conductive layer is formed on its bottom face;

a light transmitting lower substrate where a lower conductive layer is formed on its top face; and

a light transmitting piezoelectric material in which a voltage is generated in a thickness direction by a pressing force,

wherein the light transmitting piezoelectric material is sandwiched between the upper conductive layer and the lower conductive layer.

2 . The touch panel of claim 1 , wherein the light transmitting piezoelectric material is made of polyvinylidene-fluoride.

3 . A manufacturing method of a touch panel, comprising:

giving piezoelectricity in a thickness direction to a polyvinylidene-fluoride film by applying an electric field to top and bottom faces of the film while stretching the film;

fabricating a sheet of piezoelectric material by cutting the polyvinylidene-fluoride film to which piezoelectricity is given;

forming a thin film of one of indium tin oxide and tin oxide on one of a polyethylene terephthalate film, polycarbonate film, and glass;

fabricating a upper substrate and a lower substrate by cutting one of the indium tin oxide and tin oxide on one of a polyethylene terephthalate film, polycarbonate film, and glass, forming an upper conductive layer on the top substrate, and forming a lower conductive layer on the bottom substrate; and

holding the piezoelectric material by sandwiching the piezoelectric material between the upper conductive layer and the lower conductive layer.

Assignments (4)
CORRECTIVE ASSIGNMENT TO CORRECT THE ERRONEOUSLY FILED APPLICATION NUMBERS 13/384239, 13/498734, 14/116681 AND 14/301144 PREVIOUSLY RECORDED ON REEL 034194 FRAME 0143. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Dec 24, 2020
From: PANASONIC CORPORATION
To: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Reel/Frame 056788/0362 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 10, 2014
From: PANASONIC CORPORATION
To: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Reel/Frame 034194/0143 →
CHANGE OF NAME Recorded Nov 24, 2008
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 021897/0689 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 16, 2007
From: MATSUMOTO, KENICHI
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 019969/0367 →