IP Library Granted Patent US 7,632,438
Granted Patent B2
US 7,632,438 · App. 11/753,922 · Granted Dec 15, 2009

Intelligent manifold and injection molding machine

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Quick Facts
Patent No.
US 7,632,438
App. No.
11/753,922
Granted
Dec 15, 2009
Kind
B2
Abstract

An injection molding machine system includes a hot runner comprising a memory device configured to contain at least one process control parameter. The memory device may transmit a signal representative of the process control parameter to a machine controller associated with the injection molding machine system. The machine controller may generate control signal to operate the injection molding machine system based on, at least in part, the signal from the memory device, wherein the at least one memory device is pre-programmed to have the information pertaining to the at least one process control parameter prior to a first run in the injection molding system.

Claims (74)

1. A hot runner system for use with an injection molding machine system, said hot runner system comprising:

a manifold comprising a plurality of melt channels including at least one inlet configured to be in fluid communication with a source of molten resin and at least one outlet configured be coupled to at least one nozzle; and

at least one memory device coupled to said manifold, said at least one memory device including information pertaining to at least one process control parameter of said injection molding machine system, said at least one memory device further configured to transmit a signal to a machine controller associated with said injection molding machine system representative of said at least one process control parameter,

wherein the at least one memory device is pre-programmed to have the information pertaining to the at least one process control parameter prior to a first run in the injection molding system.

2. The hot runner system of claim 1 , wherein:

said machine controller comprises a stand alone controller and wherein said at least one memory device is configured to transmit said signal directly to stand along controller.

3. The hot runner system of claim 2 , further comprising:

an injection molding machine controller.

4. The hot runner system of claim 3 , wherein:

said stand alone controller is configured to transmit a single directly to said injection molding machine controller.

5. The hot runner system of claim 1 , wherein:

said machine controller includes an injection molding machine controller and wherein said at least one memory device is configured to transmit said signal directly to stand along controller.

6. The hot runner system of claim 1 , wherein:

said at least one process control parameter comprises a plurality of temperature profiles of said plurality of melt channels.

7. The hot runner system of claim 1 , wherein:

said at least one process control parameter comprises a temperature profile of a sprue bushing.

8. The hot runner system of claim 1 , wherein:

said at least one process control parameter comprises a temperature profile of said at least one nozzle.

9. The hot runner system of claim 1 , wherein:

said at least one process control parameter comprises mold set-up data.

10. The hot runner system of claim 9 , wherein:

said mold set-up data includes resin flow rate data.

11. The hot runner system of claim 9 , wherein:

said mold set-up data includes at least one selected from the group consisting of injection velocity profiles, packing pressure magnitudes, gate freeze determination and pressure profiles, and timing for opening and closing of at least one valve.

12. The hot runner system of claim 1 , wherein:

said at least one process control parameter further includes maintenance data.

13. The hot runner system of claim 1 , wherein:

said manifold further comprises at least one sensor configured to provide a signal representative of said at least one process control parameter, wherein said at least one memory device is configured to receive said signal from said at least one sensor.

14. The hot runner system of claim 13 , wherein:

said at least one memory device is configured to transmit a signal representative of said signal from said at least one sensor to said machine controller.

15. The hot runner system of claim 1 , wherein:

said at least one process control parameter includes a pointer to a database coupled to said machine controller.

16. An injection molding machine system, comprising:

a hot runner system having a hot runner manifold comprising a plurality of melt channels including at least one inlet configured to be in fluid communication with a source of molten resin and at least one outlet configured be coupled to at least one nozzle;

a mold configured to receive molten resin from said at least one nozzle;

a machine controller for generating a plurality of control signals to operate said injection molding machine system; and

at least one memory device coupled to said hot runner manifold, said at least one memory device including information pertaining to at least one process control parameter of said injection molding machine system and configured to transmit a signal to said machine controller representative of said at least one process control parameter,

wherein the at least one memory device is pre-programmed to have the information pertaining to the at least one process control parameter prior to a first run in the injection molding system.

17. The injection molding machine system of claim 16 , wherein:

said machine controller is responsive to, at least in part, said signal from said at least one memory device.

18. The injection molding machine system of claim 16 , wherein:

said machine controller comprises a stand alone controller and wherein said at least one memory device is configured to transmit said signal directly to stand along controller.

19. The injection molding machine system of claim 18 , further comprising:

an injection molding machine controller.

20. The injection molding machine system of claim 19 , wherein:

said stand alone controller is configured to transmit a single directly to said injection molding machine controller.

21. The injection molding machine system of claim 16 , wherein:

said machine controller includes an injection molding machine controller and wherein said at least one memory device is configured to transmit said signal directly to stand along controller.

22. The injection molding machine system of claim 17 , wherein:

said at least one process control parameter comprises a plurality of temperature profiles of said plurality of melt channels.

23. The injection molding machine system of claim 17 , wherein:

said at least one process control parameter comprises a temperature profile of a sprue bushing.

24. The injection molding machine system of claim 17 , wherein:

said at least one process control parameter comprises a temperature profile of said at least one nozzle.

25. The injection molding machine system of claim 17 , wherein:

said at least one process control parameter comprises mold set-up data.

26. The injection molding machine system of claim 17 , further comprising:

at least one sensor configured to provide a signal representative of said at least one process control parameter, wherein said at least one memory device is configured to receive said signal from said at least one sensor.

27. The injection molding machine system of claim 17 , wherein:

said at least one memory device is configured to transmit a signal representative of said signal from at least one sensor to said machine controller.

28. A method of controlling operation of an injection molding machine system, the method comprising:

providing at least one memory device coupled to a hot runner manifold of a hot runner system with information pertaining to at least one process control parameter of said injection molding machine system, the hot runner manifold comprising a plurality of melt channels, wherein the at least one memory device is pre-programmed to have the information pertaining to the at least one process control parameter prior to a first run in the injection molding system;

transmitting a signal representative of said at least one process control parameter to a machine controller associated with said injection molding machine system; and

generating a plurality of control signals to operate said injection molding machine system based on, at least in part, said signal from said at least one memory device.

29. The method of claim 28 , wherein:

said at least one process control parameter comprises a plurality of temperature profiles of said plurality of melt channels.

30. The method of claim 28 , wherein:

said at least one process control parameter comprises a temperature profile of a sprue bushing.

31. The method of claim 28 , wherein:

said at least one process control parameter comprises a temperature profile of at least one nozzle.

32. The method of claim 28 , wherein:

said at least one process control parameter comprises mold set-up data.

33. The method of claim 28 , further comprising:

receiving a signal generated by at least one sensor coupled to said injection molding machine system at said at least one memory device.

Assignments (7)
SECURITY AGREEMENT Recorded Mar 16, 2026
From: HUSKY INJECTION MOLDING SYSTEMS LTD.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 075094/0766 →
SECURITY AGREEMENT Recorded Mar 16, 2026
From: HUSKY INJECTION MOLDING SYSTEMS LTD.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 075094/0711 →
PATENT SECURITY AGREEMENT (NOTES) Recorded Apr 24, 2024
From: HUSKY INJECTION MOLDING SYSTEMS LTD.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 067204/0757 →
SECURITY AGREEMENT Recorded Apr 2, 2018
From: HUSKY INJECTION MOLDING SYSTEMS LTD.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 045803/0846 →
RELEASE OF SECURITY AGREEMENT Recorded Jul 19, 2011
From: ROYAL BANK OF CANADA
To: HUSKY INJECTION MOLDING SYSTEMS LTD.
Reel/Frame 026647/0595 →
SECURITY AGREEMENT Recorded Jan 30, 2008
From: HUSKY INJECTION MOLDING SYSTEMS LTD.
To: ROYAL BANK OF CANADA
Reel/Frame 020431/0495 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2007
From: BAUMANN, MARTIN, MR.
To: HUSKY INJECTION MOLDING SYSTEMS LTD.
Reel/Frame 019345/0859 →