Process for forming an isolated electrically conductive contact through a metal package
View Patent ↗A method of forming an isolated electrically conductive contact through a metal substrate by creating at least one via through the substrate. The at least one sidewall of the via is cleaned and coated with a non-conductive layer. In one example, the non-conductive layer is formed by anodizing the sidewall(s) of the via. In another example, the non-conductive layer may be formed by thin film deposition of a dielectric on the sidewall(s). An electrically conductive filler is then placed into the via. In the examples disclosed, the filler may be a conductive ink or a conductive epoxy.
1. A method of creating an electrically isolated contact comprising:
forming a via in a metallic substrate wherein the via includes a first opening in a top surface of the metallic substrate, a second opening in an opposing bottom surface of the metallic substrate and at least one sidewall extending between the first opening and the second opening;
forming a dielectric sleeve on the at least one sidewall of the via, the dielectric sleeve formed through anodization; and
filling the via with an electrically conductive material.
2. The method as in claim 1 wherein the substrate is comprised of aluminum and the aluminum is anodized after the via is formed.
3. The method as in claim 2 wherein the at least one sidewall of the via is cleaned with an etching process prior to anodizing.
4. The method as in claim 3 wherein the via is cleaned using a sodium hydroxide alkaline etch.
5. The method as in claim 1 wherein the substrate includes a pocket formed therein, the pocket including at least one sidewall and a base and the via being formed in the base of the pocket.
6. The method as in claim 1 wherein the electrically conductive material is a silver nano particle liquid conductive epoxy.
7. A housing having an isolated electrical contact wherein the isolated electrical contact comprises:
a via having a first opening in a top surface of a portion of the housing, a second opening in an opposing bottom surface of the portion and a via sidewall extending between the first opening and the second opening;
an electrically insulating sleeve formed on the via sidewall; and
a conductive filler captured by the insulating sleeve of the via sidewall, wherein the housing is made from aluminum and the insulating sleeve is a layer of anodized aluminum.
8. The housing as in claim 7 comprising a portion of an antenna using a plurality of isolated electrical contacts.
9. A housing made from a metal and having an isolated electrical contact wherein the isolated electrical contact is formed by a method comprising:
forming a via in the housing through drilling using a laser, the via including a first opening in a top surface of a portion of the housing, a second opening in an opposing bottom surface of the portion and at least one sidewall extending between the first opening and the second opening;
cleaning the housing and the at least one sidewall;
anodizing the housing and the at least one sidewall; and
filling the via with an electrically conductive filler.
10. The housing as in claim 9 wherein the via has a diameter between 20 and 200 microns.
11. The housing in claim 10 wherein the isolated electrical contact operates as an on/off switch.
12. The method of claim 1 wherein the electrically conductive material is a conductive ink.
13. The housing of claim 7 wherein the electrically conductive filler is a conductive ink.
14. The housing of claim 9 wherein the electrically conductive filler is a conductive ink.