SOLDER PASTE
In a solder paste 3 formed by allowing a resin component 3 a having oxide removability to contain solder particles 4 A, 4 B, and 4 C which are formed by coating the surfaces of core particles 6 A, 6 B, and 6 C made of tin (Sn) or an alloy of tin with silver (Ag) coating films 7 A, 7 B, and 7 C, the core particles are distributed to have such a particle distribution that the average particle diameter is in the range of 3 μm to 7 μm and 75% or more of the particles is in the range of 1 μm to 9 μm and the coating film is formed so that the core particles are coated with a silver coating film of an amount which occupies 1 to 4 wt % of the solder particles. Accordingly, it is possible to prevent oxide from being formed on the surfaces of the solder particles and to enhance the solder wettability at the time of soldering. In addition, it is possible to secure printability onto fine electrodes and to secure excellent solder adhesion with respect to a fine-pitch part by the use of a simple and low-cost method.
1 . A solder paste comprising:
solder particles in which surfaces of core particles are coated with a coating film;
a resin component having oxide film remove function; and
wherein the core particles are obtained by shaping a first metal into spherical particles and distributing the spherical particles with a particle diameter distribution in which the average particle diameter is in the range of 3 μm to 7 μm, and at least 75% of the particles is in the range of 1 μm to 9 μm, and
wherein the coating film is made of a second metal having a melting point higher than that of the first metal, hardly generating a natural oxide film, and being capable of forming an alloy along with the first metal, and
the amount of the coating film relative to the entire solder particles is set to a range in which the melting point of the alloy formed by the first metal and the second metal is lower than the melting point of the first metal.
2 . The solder paste according to claim 1 , wherein maximum diameter of the core particle is set to be less than 15 μm.
3 . The solder paste according to claim 1 , wherein the first metal is one of tin and an alloy containing tin as a primary component and not containing lead (Pb) and the second metal is silver (Ag).
4 . The solder paste according to claim 3 , wherein the first metal contains 0.8 wt % or less of copper.
5 . The solder paste according to claim 3 , wherein the coating film is formed by plating the surfaces of the core particles with silver by the use of an electroless reduction plating method.
6 . The solder paste according to claim 3 , wherein the amount of silver is 1 to 4 wt % of the solder particles.
7 . The solder paste according to claim 1 , wherein the resin component is a thermosetting resin.
8 . The solder paste according to claim 1 , wherein the resin component is a soldering flux.
9 . A solder paste comprising:
solder particles in which surfaces of core particles are coated with a coating film,
a resin component having oxide film remove function; and
wherein the core particles are obtained by shaping tin (Sn) or an alloy containing tin as a primary component but not containing lead (Pb) into spherical particles and distributing the spherical particles with a particle diameter distribution in which the average particle diameter is in the range of 3 μm to 7 μm and at least 75% of the particles is in the range of 1 μm to 9 μm, and
wherein the coating film is formed by coating the surfaces of the core particles with a silver (Ag) film of an amount which occupies 1 to 4 wt % of the solder particles.
10 . The solder paste according to claim 9 , wherein maximum diameter of the core particle is set to be less than 15 μm.
11 . The solder paste according to claim 9 , wherein the silver film is formed by plating the surfaces of the core particles with silver by the use of an electroless reduction plating method.
12 . The solder paste according to claim 9 , wherein the amount of silver occupies 1 to 4 wt % of the solder particles.
13 . The solder paste according to claim 9 , wherein the resin component is a thermosetting resin.
14 . The solder paste according to claim 9 , wherein the resin component is a soldering flux.