Semiconductor integrated circuit device
View Patent ↗Disclosed is a semiconductor IC device capable of suppressing the interference of noise generated in one functional block with other functional blocks therein while protecting against electrostatic breakdown. A plurality of isolated pads are connected to a first terminal through respective wires, and further connected to a plurality of isolated pads each connected to a second terminal having the same function as that of the first terminal, so as to reduce noise interference based on the pad isolation and protect against electrostatic breakdown based on the inter-pad connection.
1. A semiconductor integrated circuit device including a plurality of terminals having a same function, said terminals consisting of a plurality of source terminals or ground terminals, comprising: a plurality of lead frames connected to said terminals, respectively; a plurality of wire groups each consisting of two or more wires, said wire groups being connected to said lead frames, respectively; and a plurality of pad groups each consisting of two or more pads, said pad groups being associated with said terminals, respectively, at least one of said pads making up of one of said pad groups being connected to the remaining pad groups, to define an inter-pad connection line, wherein each of said pad groups is connected to an associated one of said lead frames through one of said wire groups which is connected to said associated lead frame, wherein said inter-pad connection line is used solely for an inter-pad connection and a surge protection line.
2. A semiconductor integrated circuit device including a plurality of terminals having a same function, said terminals consisting of a plurality of source terminals or ground terminals, comprising: a plurality of lead frames connected to said terminals, respectively; a plurality of wire groups each consisting of two or more wires, said wire groups being connected to said lead frames, respectively; and a plurality of pad groups each consisting of two or more pads, said pad groups being associated with said terminals, respectively, at least one of said pads making up of one of said pad groups being connected to the remaining pad groups, to define an inter-pad connection line, wherein each of said pad groups is connected to an associated one of said lead frames through one of said wire groups which is connected to said associated lead frame, wherein said inter-pad connection line is used for a source/ground line having a relatively low noise level, in said semiconductor integrated circuit device.
3. The semiconductor integrated circuit device according to claim 1 , which includes an electrostatic-breakdown protection element between each of said pads and said inter-pad connection line.
4. The semiconductor integrated circuit device according to claim 2 , which includes an electrostatic-breakdown protection element between each of said pads and said inter-pad connection line.