Thin film transistor array panel and method of manufacturing the same
View Patent ↗A thin film transistor array panel includes a passivation layer formed on a plurality of end portions of a plurality of gate lines. A portion of the passivation layer has a porous structure formed between a connection portion of a flexible printed circuit substrate and a thin film transistor substrate such that when the flexible printed circuit substrate and the thin film transistor array panel are connected to each other, the passivation layer having a porous structure and which is formed at the connection portion therebetween connects the flexible printed circuit substrate with the thin film transistor array panel thereby minimizing an exposed area of the metal of the connection portion to improve a corrosion resistance thereof.
1. A thin film transistor array panel comprising:
a substrate;
gate lines formed on the substrate, each gate line having an end portion;
a gate insulating layer formed on the gate lines;
a passivation layer formed on the gate lines, the passivation layer having a plurality of first contact holes which expose each of the end portions of the gate lines;
a plurality of contact assistants connected to the end portions of the gate lines through the plurality of first contact holes of the passivation layer,
wherein each of the end portions of the gate lines is connected to one of the contact assistants of the plurality of contact assistants through at least two of the first contact holes,
wherein the gate insulating layer comprises a plurality of second contact holes and the at least two of the first contact holes exposing a single end portion of the gate lines are located within a single second contact hole of the plurality of second contact holes.
2. The thin film transistor array panel of claim 1 , wherein the passivation layer comprises multi layers including an inorganic layer and an organic layer.
3. The thin film transistor array panel of claim 1 , wherein the passivation layer comprises a single inorganic layer.
4. The thin film transistor array panel of claim 1 , wherein diameter of the first contact hole ranges 3˜6 μm and distance between two neighboring first contact holes ranges 6˜8 μm.
5. A thin film transistor array panel comprising:
a substrate;
gate lines formed on the substrate, each gate line having an end portion;
a gate insulating layer formed on the gate lines, the gate insulating layer comprising a plurality of first contact holes which expose each of the end portions of the gate lines;
corrosion protecting layers formed on the gate insulating layer and connected to each of the end portions of the gate lines through the plurality of first contact holes;
a passivation layer formed on the corrosion protecting layers and which comprises a plurality of second contact holes which expose the corrosion protecting layers; and
a plurality of contact assistants connected to the corrosion protecting layers through the plurality of second contact holes,
wherein each of the corrosion protecting layers is connected to one of the contact assistants through at least two of the second contact holes.
6. The thin film transistor array panel of claim 5 , wherein the passivation layer further comprises multi layers including an inorganic layer and an organic layer.
7. The thin film transistor array panel of claim 5 , wherein the passivation layer comprises a single inorganic layer.
8. The thin film transistor array panel of claim 5 , wherein diameter of the second contact hole ranges 3˜6 μm and distance between two neighboring first contact holes ranges 6˜8 μm.
9. The thin film transistor array panel of claim 5 , wherein the corrosion protecting layers comprise a molybdenum-based metal, a copper-based metal, a titanium-based metal, and a chromium-based metal.