IP Library Granted Patent US 7,724,839
Granted Patent B2
US 7,724,839 · App. 11/757,479 · Granted May 25, 2010

Multilevel LINC transmitter

Assignee: Mediatek Inc.
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Quick Facts
Patent No.
US 7,724,839
App. No.
11/757,479
Granted
May 25, 2010
Kind
B2
Abstract

A multilevel LINC transmitter. The multilevel LINC transmitter comprises a multilevel signal component separator, a phase modulator block, and an RF block. The multilevel signal component separator comprises a multilevel scaler and converts a base band signal to constant envelope signals. The phase modulator block is coupled to the multilevel signal component separator. The RF block comprises a plurality of power amplifiers coupled to the phase modulator block and the multilevel scaler and a power combiner coupled to the power amplifiers.

Claims (13)

1. A multilevel LINC transmitter, comprising:

a multilevel signal component separator comprising a multilevel scaler and converting an input signal to phase signals;

a phase modulator block coupled to the multilevel signal component separator; and

an RF block comprising a plurality of power amplifiers coupled to the phase modulator block and the multilevel scaler and a power combiner coupled to the power amplifiers.

2. The multilevel LINC transmitter as claimed in claim 1 , wherein the multilevel scaler comprises an slicer and a ROM coupled to the slicer.

3. The multilevel LINC transmitter as claimed in claim 2 , wherein the slicer comprises a comparator.

4. The multilevel LINC transmitter as claimed in claim 1 , further comprising an envelope modulator coupled to the multilevel scaler and the power amplifiers.

5. The multilevel LINC transmitter as claimed in claim 4 , wherein the envelope modulator comprises a digital to analog converter (DAC) coupled to the multilevel scaler and a low pass filter (LPF) coupled between the DAC and the power amplifiers.

6. The multilevel LINC transmitter as claimed in claim 5 , wherein the envelope modulator further comprises a low drop-out (LDO) regulator coupled between the LPF and the power amplifier.

7. The multilevel LINC transmitter as claimed in claim 6 , further comprising a delay compensator coupled between the phase modulator block and the RF block.

8. The multilevel LINC transmitter as claimed in claim 4 , further comprising a distortion compensator coupled between the multilevel signal component separator and the envelope modulator.

9. The multilevel LINC transmitter as claimed in claim 8 , further comprising a sensor coupled to the distortion compensator.

10. The multilevel LINC transmitter as claimed in claim 1 , wherein the power combiner is a Wilkinson combiner.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 4, 2007
From: CHEN, YUAN-JYUE; JHENG, KAI-YUAN; WU, AN-YEU; TSAO, HEN-WAI; TSENG, POSEN
To: MEDIATEK INC.; NATIONAL TAIWAN UNIVERSITY
Reel/Frame 019373/0607 →
Continuity (2)
Provisional Application 6080795200 · Jul 21, 2006
Related Publication 20080019459A1 · Jan 24, 2008