Thermally enhanced memory module
View Patent ↗A thermally enhanced memory module is claimed. The memory module includes a first extended electrical plane, and a thermal connection between a surface plane of its substrate and the first extended electrical plane. A first thermal management, such as a heat spreader, is coupled to the surface plane of the substrate and to the thermal connection.
1. A method of thermally enhancing a memory module, the memory module having a substrate, the substrate comprising a plurality of electrical planes, the method comprising:
extending a first of the plurality of electrical planes of the substrate;
providing a thermal connection between a top surface plane of the substrate and the first electrical plane, wherein the top surface plane of the substrate is one on which one or more memory devices of a first plurality of memory devices are mounted;
coupling a first thermal management structure to the top surface plane of the substrate and to the thermal connection, wherein the thermal connection comprises thermal vias; and
coupling a second thermal management structure to a bottom surface plane of the substrate, wherein the bottom surface plane of the substrate is one on which one or more memory devices of a second plurality of memory devices are mounted, the thermal connection connecting the bottom surface plane of the substrate to the first electrical plane, the second thermal management structure also coupled to the thermal connection.
2. The method of claim 1 , wherein the first thermal management structure and the second thermal management structure are heat spreaders.
3. The method of claim 1 , wherein the first thermal management structure and the second thermal management structure have a plurality of fins extending laterally from a base.
4. The method of claim 1 , further comprising:
further coupling the first thermal management structure to a top surface of the memory module; and
further coupling the second thermal management structure to a bottom surface of the memory module.
5. The method of claim 1 , further comprising:
coupling a third thermal management structure to a top surface of the memory module, on top of the one or more memory devices of the first plurality of memory devices; and
coupling a fourth thermal management structure to a bottom surface of the memory module, on top of the one or more memory devices of the second plurality of memory devices.
6. The method of claim 5 , further comprising:
placing a gap filler between the first thermal management structure and the third thermal management structure.
7. A system, comprising:
a memory module, the memory module having:
a substrate, the substrate comprising a first extended electrical plane, and a thermal connection between a top surface plane of the substrate and the first extended electrical plane;
one or more memory devices of a first plurality of memory devices mounted on the top surface plane of the substrate;
a first thermal management structure, the first thermal management structure coupled to the top surface plane of the substrate, the first thermal management structure also coupled to the thermal connection, wherein the thermal connection comprises thermal vias;
a second thermal management structure coupled to a bottom surface plane of the substrate, the second thermal management structure also coupled to the thermal connection; and
one or more memory devices of a second plurality of memory devices mounted on the bottom surface plane of the substrate.
8. The system of claim 7 , wherein the first thermal management structure and the second thermal management structure are heat spreaders.
9. The system of claim 7 , the first thermal management structure and the second thermal management structure further comprising:
a plurality of fins extending laterally from a base.
10. The system of claim 7 , wherein
the first thermal management structure is further coupled to a top surface of the memory module, and
the second thermal management structure is further coupled to a bottom surface of the memory module.
11. The system of claim 8 , further comprising:
a third thermal management structure coupled to a top surface of the memory module, on top of the one or more memory devices of the first plurality of memory devices; and
a fourth thermal management structure coupled to a bottom surface of the memory module, on top of the one or more memory devices of the second plurality of memory devices.
12. The system of claim 11 , further comprising:
a gap filler between the first thermal management structure and the third thermal management structure.