Articles comprising a polyimide solvent cast film having a low coefficient of thermal expansion and method of manufacture thereof

1. An article comprising a solvent cast film, the film comprising:

a thermoplastic polyimide comprising structural units derived from polymerization of a dianhydride component comprising a dianhydride selected from the group consisting of 3,4′-oxydiphthalic dianhydride, 3,3′-oxydiphthalic dianhydride, 4,4′-oxydiphthalic dianhydride, and combinations thereof, with a diamine component comprising 4,4′-diaminodiphenylsulfone and p-phenylene diamine;

wherein the polyimide has a glass transition temperature from 190° C. to 400° C.; and

wherein the film has

a coefficient of thermal expansion of less than 30 ppm/° C. measured over 30° C. to 200° C.,

a thickness from 0.1 to 250 micrometers, and

less than 5% residual solvent by weight; and

wherein the film further comprises a nanoclay and has a lower CTE (measured over 30° C. to 200° C.) than a film of the same composition without the nanoclay.

2. The article of claim 1 , wherein the dianhydride component further comprises a dianhydride selected from the group consisting of:

2,2′-bis(1,3-trifluoromethyl-4-phenyl)-3,3′,4,4′-biphenyltetracarboxylic dianhydride

2,2′-bis(1-methyl-4-phenyl)-3,3′,4,4′-biphenyltetracarboxylic dianhydride;

2,2′-bis(1-phenyl-4-phenyl)-3,3′,4,4′-biphenyltetracarboxylic dianhydride;

2,2′-bis(1-trifluoromethyl-2-phenyl)-3,3′,4,4′-biphenyltetracarboxylic dianhydride;

2,2′-bis(1-trifluoromethyl-3-phenyl)-3,3′,4,4′-biphenyltetracarboxylic dianhydride;

2,2′-bis(1-trifluoromethyl-4-phenyl)-3,3′,4,4′-biphenyltetracarboxylic dianhydride;

2,2′-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride;

2,2-bis((4-(3,3-dicarboxyphenoxy)phenyl)hexafluoropropane dianhydride;

2,2-bis((4-(3,3-dicarboxyphenoxy)phenyl)propane dianhydride;

2,2-bis[4-(2,3-dicarboxyphenoxy)phenyl]propane dianhydride;

2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride;

2,2′-dibromo-3,3′,4,4′-biphenyltetracarboxylic dianhydride;

2,3,6,7-naphthalic dianhydride;

3,3′,4,4′-benzophenonetetracarboxylic dianhydride;

3,3′,4,4′-biphenylethertetracarboxylic dianhydride;

3,3′,4,4′-biphenylsulphonictetracarboxylic dianhydride;

3,3′,4,4′-biphenyltetracarboxylic dianhydride;

3,3′,4,4′-dimethyldiphenylsilane tetracarboxylic dianhydride;

3,3′,4,4′-diphenylmethane tetracarboxylic dianhydride;

3,3′,4,4′-diphenylsulfide tetracarboxylic dianhydride;

3,3′,4,4′-diphenylsulfone tetracarboxylic dianhydride;

3,3′,4,4′-diphenylsulfoxide tetracarboxylic dianhydride;

3,3′-benzophenone tetracarboxylic dianhydride;

4-(2,3-dicarboxyphenoxy)-4′-(3,4-dicarboxyphenoxy)benzophenone dianhydride;

4-(2,3-dicarboxyphenoxy)-4′-(3,4-dicarboxyphenoxy)diphenylether dianhydride;

4-(2,3-dicarboxyphenoxy)-4′-(3,4-dicarboxyphenoxy)diphenylsulfide dianhydride;

4-(2,3-dicarboxyphenoxy)-4′-(3,4-dicarboxyphenoxy)diphenylsulfone dianhydride;

4-(2,3-dicarboxyphenoxy)-4′-(3,4-dicarboxyphenoxy)diphenyl-2,2-propane dianhydride;

4,4′-bis(2,3-dicarboxyphenoxy)benzophenone dianhydride;

4,4′-bis(2,3-dicarboxyphenoxy)diphenylether dianhydride;

4,4′-bis(2,3-dicarboxyphenoxy)diphenylsulfide dianhydride;

4,4′-bis(2,3-dicarboxyphenoxy)diphenylsulfone dianhydride;

4,4′-bis(3,4-dicarboxyphenoxy)diphenylpropane dianhydride;

4,4′-bis(3,4-dicarboxyphenoxy)diphenylsulfide dianhydride;

4,4′-bis(3,4-dicarboxyphenoxy)diphenylsulphone dianhydride;

4,4′-bis(3,4-dicarboxyphenoxy)benzophenone dianhydride;

4,4′-bis(3,4-dicarboxyphenoxy)diphenylether dianhydride;

4,4′-bis(3,4-dicarboxyphenoxy)diphenylsulfide dianhydride;

4,4′-bis(3,4-dicarboxyphenoxy)diphenylsulfone dianhydride;

4,4′-bisphenol A dianhydride;

4,4′-carbonyldiphthalic dianhydride;

4,4′-oxydiphthalic dianhydride;

6,6′-bis(3,4-dicarboxyphenoxy)-2,2′,3,3′-tetrahydro-3,3,3′,3′-tetramethyl-1,1′-spirobi[1H-indene]dianhydride;

7,7′-bis(3,4-dicarboxyphenoxy)-3,3′,4,4′-tetrahydro-4,4,4′,4′-tetramethyl-2,2′-spirobi[2H-1-benzopyran]dianhydride;

bis(phthalic)phenylsulphineoxide dianhydride;

bis(triphenylphthalic)-4,4′-diphenylether dianhydride;

bis(triphenylphthalic)-4,4′-diphenylmethane dianhydride;

hydroquinone diphthalic dianhydride;

m-phenylene-bis(triphenylphthalic)dianhydride;

p-phenylene-bis(triphenylphthalic)dianhydride;

pyromellitic dianhydride;

(3,3′,4,4′-diphenyl)phenylphosphinetetracarboxylic dianhydride;

(3,3′,4,4′-diphenyl)phenylphosphineoxidetetracarboxylic dianhydride;

1,3-bis(2,3-dicarboxyphenoxy)benzene dianhydride;

1,3-bis(3,4-dicarboxyphenoxy)benzene dianhydride;

1,4-bis(2,3-dicarboxyphenoxy)benzene dianhydride;

1,4-bis(3,4-dicarboxyphenoxy)benzene dianhydride; and a combination thereof.

3. The article of claim 1 , wherein the diamine component further comprises a diamine selected from the group consisting of:

1,5-diaminonaphthalene;

2,2′,3,3′-tetrahydro-3,3,3′,3′-tetramethyl-1,1′-spirobi[1H-indene]-6,6′-diamine;

2,4-diaminotoluene;

2,6-diaminotoluene;

3,3′,4,4′-tetrahydro-4,4,4′,4′-tetramethyl-2,2′-spirobi[2H-1-benzopyran]-7,7′-diamine;

3,3′-dimethoxybenzidine;

3,3′-dimethylbenzidine;

4,4′-diaminodiphenylether(4,4′-oxydianiline);

4,4′-diaminodiphenylsulfide;

4,4′-diaminodiphenylmethane(4,4′-methylenedianiline);

4,4′-diaminodiphenylpropane;

benzidine;

bis(4-aminophenyl)ether;

bis(4-aminophenyl)sulfide;

bis(4-aminophenyl)methane;

bis(4-aminophenyl)propane;

m-phenylenediamine;

m-xylylenediamine;

p-xylylenediamine; and

a combination thereof.

4. The article of claim 1 , wherein the diamine component further comprises a diamine selected from the group consisting of m-phenylenediamine, 4,4′-oxydianiline, 1,3-bis(4-aminophenoxy)benzene, 1,3-bis(3-aminophenoxy)benzene, and a combination thereof.

5. The article of claim 1 , wherein the solvent comprises N,N-dimethylacetamide, N,N-dimethylformamide, N-methylpyrrolidinone, dimethylsulfoxide, sulfolane, tetrahydrofuran, benzophenone, cyclohexanone, phenol, o-cresol, p-cresol, m-cresol, phenol, ethylphenol, isopropylphenol, t-butylphenol, xylenol, mesitol, chlorophenol, dichlorophenol, phenylphenol, a monoalkyl ether of ethylene glycol having from 1 to about 4 carbon atoms in the alkyl group, a monoalkyl ether of diethylene glycol having from 1 to about 4 carbon atoms in the alkyl group, a monoaryl ether glycol, a monoaryl ether of propylene glycol, tetramethylurea, phenoxy ethanol, propylene glycol phenyl ether, anisole, veratrole, o-dichlorobenzene, chlorobenzene, trichloroethane, methylene chloride, chloroform, pyridine, N-cyclohexylpyrrolidinone, ethyl lactate, an ionic liquid, or a combination thereof.

6. The article of claim 1 , wherein the film has a Tg that is the same as a film of the same composition without the nanoclay.

7. The article of claim 1 , wherein the film is transparent.

8. The film of claim 1 , wherein the film has a coefficient of thermal expansion of at least 5 ppm/° C. measured over 30° C. to 200° C.

9. The article of claim 1 , wherein the film has a coefficient of thermal expansion from 10 to 30 ppm/° C. measured over 30° C. to 200° C.

10. The article of claim 1 , wherein the film has a coefficient of thermal expansion from 10 to 20 ppm/° C. measured over 30° C. to 200° C.

11. The article of claim 1 , wherein the film has a coefficient of thermal expansion that is within ±20 ppm/° C. (measured over 30° C. to 200° C.) of the coefficient of thermal expansion of copper, silicon, aluminum, gold, silver, nickel, a glass, a ceramic, or a polymer.

12. The film of claim 1 , wherein the film has a coefficient of thermal expansion that is within ±15 ppm/° C. (measured over 30° C. to 200° C.) of the coefficient of thermal expansion of copper.

13. The article of claim 1 , wherein the film loses less than 5% of its initial weight after storage in water for 24 hours at 25° C.

14. The article of claim 1 , wherein the film loses less than 2% of its initial weight after storage in water for 24 hours at 25° C.

15. The article of claim 1 , wherein the film is a dry film, and a 10 wt % solution of the dried film in dimethylacetamide or N-methylpyrrolidinone has an inherent viscosity that is greater than 0.05 dl/g.

16. The article of claim 1 , wherein after lamination to a substrate at a temperature from 250° C. to 450° C., the coefficient of thermal expansion of the laminated film is within ±10 ppm/° C. (measured over 30° C. to 200° C.) of the coefficient of thermal expansion of the film prior to lamination.

17. The article of claim 1 , wherein the film is cast from a composition comprising 1 to 30 wt % solids.

18. The article of claim 1 , further comprising up to 50 wt % of a recycled polyimide film comprising structural units derived from the dianhydride component and a diamine component, wherein prior to recycling the polyimide has a glass transition temperature from 210° C. to 450° C.; and the film has a coefficient of thermal expansion of less than 30 ppm/° C. measured over 30° C. to 200° C., a thickness from 1 to 250 micrometers, and less than 5% residual solvent by weight.

19. The article of claim 1 , wherein the film further comprises up to 30 wt % of a recycled polyimide film comprising structural units derived from the dianhydride component and a diamine component, wherein prior to recycling the polyimide has a glass transition temperature from 210° C. to 450° C.; and the film has a coefficient of thermal expansion of less than 30 ppm/° C. measured over 30° C. to 200° C., a thickness from 1 to 250 micrometers, and less than 5% residual solvent by weight.

20. The article of claim 18 , wherein the coefficient of thermal expansion of the film comprising the recycled polyimide film is within 10 ppm/° C. (measured over 30° C. to 200° C.) of the coefficient of thermal expansion of the film without the recycled polyimide film.

21. The article of claim 1 , wherein the film is disposed on a first substrate.

22. The article of claim 21 , wherein the first substrate is selected from the group consisting of copper, silicon, aluminum, gold, silver, nickel, a glass, a ceramic, and a polymer.

23. The article of claim 22 , wherein the polymer is a solvent cast thermoplastic polyimide film comprising structural units derived from polymerization of a dianhydride component comprising a dianhydride selected from the group consisting of 3,4′-oxydiphthalic dianhydride, 3,3′-oxydiphthalic dianhydride, 4,4′-oxydiphthalic dianhydride, and combinations thereof, with a diamine component comprising 4,4′-diaminodiphenylsulfone and p-phenylene diamine;

wherein the polyimide has a glass transition temperature of at least 190° C.;

wherein the film has

a coefficient of thermal expansion of less than 30 ppm/° C. measured over 30° C. to 200° C.,

a thickness from 0.1 to 250 micrometers, and

less than 5% residual solvent by weight;

wherein the polyimide has less than 15 molar % of structural units derived from a member selected from the group consisting of biphenyltetracarboxylic acid, a dianhydride of biphenyltetracarboxylic acid, an ester of biphenyltetracarboxylic acid, and a combination thereof.

24. The article of claim 21 , further comprising a second substrate disposed on a side of the film opposite the first substrate.

25. The article of claim 24 , wherein the second substrate is selected from the group consisting of copper, silicon, aluminum, gold, silver, nickel, glass, ceramic, a polymer, and a combination thereof.

26. The article of claim 25 , wherein the polymer is a solvent cast polyimide film comprising structural units derived from polymerization of a dianhydride component comprising a dianhydride selected from the group consisting of 3,4′-oxydiphthalic dianhydride, 3,3′-oxydiphthalic dianhydride, 4,4′-oxydiphthalic dianhydride, and combinations thereof, with a diamine component comprising 4,4′-diaminodiphenylsulfone;

wherein the polyimide has a glass transition temperature of at least 190° C.;

wherein the film has

a coefficient of thermal expansion of less than 60 ppm/° C. measured over 30° C. to 200° C.,

a thickness from 0.1 to 250 micrometers, and

less than 5% residual solvent by weight;

wherein the polyimide has less than 15 molar % of structural units derived from a member selected from the group consisting of biphenyltetracarboxylic acid, a dianhydride of biphenyltetracarboxylic acid, an ester of biphenyltetracarboxylic acid, and a combination thereof.

27. The article of claim 1 , wherein the article is a laminate further comprising a conductive layer comprising a metal, wherein the film is adheringly disposed on a face of the conductive layer.

28. The article of claim 27 , wherein the metal is copper, silver, gold, aluminum, or an alloy comprising at least one of the foregoing metals.

29. The article of claim 28 , wherein the metal is copper.

30. The article of claim 1 , wherein the article is a flexible printed circuit comprising a copper layer adheringly disposed on the polyimide film.

31. The article of claim 30 , further comprising a dielectric layer comprising a film other than a film of claim 1 .

32. The article of claim 1 , wherein the article is a capacitor comprising the polyimide film disposed between a first metal substrate and a second metal substrate.

33. The article of claim 1 , further comprising an electrically conductive wire substrate, wherein the polyimide film surroundingly coats at least a portion of the surface of the wire.

34. The article of claim 33 , wherein the film surrounds the surface of the wire.

35. An article comprising a solvent cast film, the film comprising:

a thermoplastic polyetherimide comprising structural units derived from the polymerization of a dianhydride component comprising a dianhydride selected from the group consisting 3,4′-oxydiphthalic dianhydride, 3,3′-oxydiphthalic dianhydride, 4,4′-oxydiphthalic dianhydride, and a combination thereof, with a diamine component comprising 4,4′-diaminodiphenylsulfone and p-phenylene diamine;

wherein the polyimide has a glass transition temperature from 190° C. to 400° C.;

wherein the film has

a coefficient of thermal expansion of less than 30 ppm/° C. measured over 30° C. to 200° C.,

a thickness from 0.1 to 250 micrometers, and

less than 5% residual solvent by weight; and

wherein the film further comprises a nanoclay and has a lower CTE (measured over 30° C. to 200° C.) than a film of the same composition without the nanoclay;

wherein the film has a coefficient of thermal expansion that is within +20 ppm/° C. (measured over 30° C. to 200° C.) of the coefficient of thermal expansion of copper, silicon, aluminum, gold, silver, nickel, a glass, a ceramic, or a polymer; and

wherein the solvent is selected from the group consisting of N,N-dimethylacetamide, N,N-dimethylformamide, N-methylpyrrolidinone, dimethylsulfoxide, sulfolane, tetrahydrofuran, benzophenone, cyclohexanone, phenol, o-cresol, p-cresol, m-cresol, phenol, ethylphenol, isopropylphenol, t-butylphenol, xylenol, mesitol, chlorophenol, dichlorophenol, phenylphenol, a monoalkyl ether of ethylene glycol having from 1 to about 4 carbon atoms in the alkyl group, a monoalkyl ether of diethylene glycol having from 1 to about 4 carbon atoms in the alkyl group, a monoaryl ether glycol, a monoaryl ether of propylene glycol, tetramethylurea, phenoxy ethanol, propylene glycol phenyl ether, anisole, veratrole, o-dichlorobenzene, chlorobenzene, trichloroethane, methylene chloride, chloroform, pyridine, N-cyclohexylpyrrolidinone, ethyl lactate, an ionic liquid, and a combination comprising at least two of the foregoing solvents.

36. An article comprising a solvent cast film, the film comprising

a thermoplastic polyetherimide comprising structural units derived from polymerization of 4,4′-oxydiphthalic dianhydride, p-phenylene diamine and 4,4′-diaminodiphenylsulfone;

wherein the polyimide has a glass transition temperature from 190° C. to 400° C.;

wherein the film has

a coefficient of thermal expansion of less than 30 ppm/° C. measured over 30° C. to 200° C.,

a thickness from 0.1 to 250 micrometers, and

less than 5% residual solvent by weight; and

wherein the film further comprises a nanoclay and has a lower CTE (measured over 30° C. to 200° C.) than a film of the same composition without the nanoclay; and

wherein the film has less than 15 molar % of biphenyltetracarboxylic acid or its dianhydride or its ester.