IP Library Granted Patent US 7,838,195
Granted Patent B2
US 7,838,195 · App. 11/759,286 · Granted Nov 23, 2010

Planar test substrate for non-contact printing

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Quick Facts
Patent No.
US 7,838,195
App. No.
11/759,286
Granted
Nov 23, 2010
Kind
B2
Abstract

There is provided an essentially planar test substrate for non-contact printing. The substrate has a first layer having a first surface energy and having a planar measurement portion. A liquid containment pattern is over at least the measurement portion of the first layer. The liquid containment pattern has a second surface energy that is different from the first surface energy. The measurement portion of the first layer and the liquid containment pattern together are substantially planar.

Claims (27)

1. An essentially planar test substrate comprising:

a first layer having a first surface energy and having a planar measurement portion,

a liquid containment pattern having a thickness no greater than 100 Å over at least the measurement portion of the first layer, said liquid containment pattern having a second surface energy,

wherein the measurement portion of the first layer and the liquid containment pattern together are substantially planar, and the second surface energy is significantly different from the first surface energy.

2. The test substrate of claim 1 wherein the first layer comprises a support.

3. The test substrate of claim 1 wherein the first layer comprises an organic layer on a support.

4. The test substrate of claim 3 wherein the organic layer comprises at least one active material.

5. The test substrate of claim 3 wherein the organic layer comprises at least one inactive material.

6. The test substrate of claim 1 wherein the first layer comprises an inorganic layer.

7. The test substrate of claim 1 wherein the first layer is formed by a technique selected from the group consisting of vapor deposition, liquid deposition, and thermal transfer.

8. The test substrate of claim 1 wherein the containment pattern has a surface energy higher than that of the first layer.

9. The test substrate of claim 1 wherein the containment pattern has a surface energy lower than that of the first layer.

10. The test substrate of claim 1 wherein the containment pattern comprises an LSE material.

11. The test substrate of claim 10 wherein the LSE material is fluorinated.

12. The test substrate of claim 1 further comprising a liquid printing composition.

13. The test substrate of claim 12 wherein the liquid printing composition has a surface energy that is less than the surface energy of the first layer, but approximately the same as or greater than the surface energy of the containment pattern.

14. The test substrate of claim 1 wherein the liquid containment pattern comprises an RSA composition.

15. The test substrate of claim 14 wherein the RSA composition is fluorinated.

16. A method of forming a containment pattern on an essentially planar test substrate including a first layer having a first surface energy and having a planar measurement portion, and a liquid containment pattern having a thickness no greater than 100 Å over at least the measurement portion of the first layer, said liquid containment pattern having a second surface energy,

wherein the measurement portion of the first layer and the liquid containment pattern together are substantially planar, and the second surface energy is significantly different from the first surface energy, comprising:

applying an RSA composition to the first layer to form the containment pattern, and

exposing the RSA composition to radiation in a pattern whereby some areas of the containment pattern are exposed and some areas are unexposed.

17. The method of claim 16 further comprising developing the RSA composition after exposure to radiation to remove either the exposed areas or the unexposed areas.

18. The method of claim 16 wherein the RSA composition is fluorinated.

19. The method of claim 16 wherein developing comprises techniques selected from the group consisting of heating, treatment with a liquid composition, treatment with an absorbent material, and treatment with a tacky material.

20. The method of claim 16 wherein the RSA composition reacts with the first layer when exposed to radiation, further comprising developing the RSA composition after exposure to remove the RSA composition in the unexposed areas.

21. The method of claim 20 further comprising developing the RSA composition after exposure to partially remove RSA composition in the exposed areas.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 22, 2019
From: E. I. DU PONT DE NEMOURS AND COMPANY
To: LG CHEM, LTD.
Reel/Frame 050150/0482 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 28, 2008
From: DUPONT DISPLAYS, INC.
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 020863/0929 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 9, 2007
From: LANG, CHARLES D.; SORICH, STEPHEN; TADEPALLI, NAGESWARA RAO; COE, NIGEL MORTON
To: DUPONT DISPLAYS, INC.
Reel/Frame 019935/0752 →