System and method for bubble removal

1. An apparatus for removing gas bubbles from a mixture of a first fluid and a second fluid, the apparatus comprising:

a first substrate, wherein the first substrate forms a top surface of a bubble removal chamber;

a second substrate, wherein the second substrate forms a bottom surface of the bubble removal chamber, wherein the bottom surface comprises a chamber entrance and a substrate coating, wherein a lower portion of the bottom surface comprises a first radius, wherein an upper portion of the bottom surface comprises a second radius, wherein the second radius is different than the first radius, and wherein the substrate coating and the first and second radii are adapted to retain the mixture of the first and second fluids within the lower portion while the gas bubbles dissipate into the chamber;

a third substrate, wherein the second and third substrates form one or more inlet channels, wherein the one or more inlet channels comprise at least one inlet opening, and wherein the one or more inlet channels are designed to provide fluidic communication between the at least one inlet opening and the bubble removal chamber such that fluids enter the bubble removal chamber through the chamber entrance; and

a venting channel, wherein the venting channel is connected with the bubble removal chamber and is designed to facilitate the exit of gas from the chamber.

2. The apparatus of claim 1 , wherein the substrate coating is hydrophilic.

3. The apparatus of claim 1 , wherein the substrate coating is hydrophobic.

4. The apparatus of claim 1 , wherein the venting channel is formed by the first and second substrate.

5. The apparatus of claim 1 , wherein the first and second radii are in the range of about 1 mm to about 20 mm.

6. A system for removing gas bubbles from a mixture of a first fluid and a second fluid, the system comprising:

one or more gas bubble removal devices, each device comprising:

a first substrate, wherein the first substrate forms a top surface of a bubble removal chamber;

a second substrate, wherein the second substrate forms a bottom surface of the bubble removal chamber, wherein the bottom surface comprises a chamber entrance and a substrate coating, wherein a lower portion of the bottom surface comprises a first radius, wherein an upper portion of the bottom surface comprises a second radius, wherein the second radius is different than the first radius, and wherein the substrate coating and the first and second radii are adapted to retain the mixture of the first and second fluids within the lower portion while the gas bubbles dissipate into the chamber;

a third substrate, wherein the second and third substrates form one or more inlet channels, wherein the one or more inlet channels comprise at least one inlet opening, and wherein the one or more inlet channels are designed to provide fluidic communication between the at least one inlet opening and the bubble removal chamber such that fluids enter the bubble removal chamber through the chamber entrance;

a venting channel, wherein the venting channel is connected with the bubble removal chamber and is designed to facilitate the exit of gas from the chamber; and

an outlet channel, wherein the outlet channel is connected with the bubble removal chamber and is designed to provide fluidic communication between the bubble removal chamber and at least one collection port such that the mixture of the first and second fluids are removed from the chamber through the outlet channel; and

a source of pressurized gas;

a plurality of valve mechanisms and a plurality of gates, wherein the valve mechanisms and the plurality of gates are designed to control the input and output of fluids and gas throughout the inlet, venting and outlet channels of the system; and

a controlling device, wherein the controlling device is designed to manage the input and output of fluids and gas within the system.

7. The system of claim 6 , wherein the substrate coating is hydrophilic.

8. The system of claim 6 , wherein the substrate coating is hydrophobic.

9. The system of claim 6 , wherein the venting channel is formed by the first and second substrate.

10. The system of claim 6 , wherein the first and second radii are in the range of about 1 mm to about 20 mm.

11. A method for removing gas bubbles from a mixture of a first fluid and a second fluid, the method comprising:

providing a gas bubble removal device, the device comprising:

a first substrate, wherein the first substrate forms a top surface of a bubble removal chamber;

a second substrate, wherein the second substrate forms a bottom surface of the bubble removal chamber, wherein the bottom surface comprises a chamber entrance and a substrate coating, wherein a lower portion of the bottom surface comprises a first radius, wherein an upper portion of the bottom surface comprises a second radius, wherein the second radius is different than the first radius, and wherein the substrate coating and the first and second radii are adapted to retain the mixture of the first and second fluids within the lower portion while the gas bubbles dissipate into the chamber;

a third substrate, wherein the second and third substrates form one or more inlet channels, wherein the one or more inlet channels comprise at least one inlet opening, and wherein the one or more inlet channels are designed to provide fluidic communication between the at least one inlet opening and the bubble removal chamber such that fluids enter the bubble removal chamber through the chamber entrance; and

a venting channel, wherein the venting channel is connected with the bubble removal chamber and is designed to facilitate the exit of gas from the chamber;

introducing a first quantity of the first fluid and a second quantity of the second fluid into the at least one inlet opening; and

using pressurized gas to transport the first quantity of the first fluid and the second quantity of the second fluid through the one or more inlet channels and into the bubble removal chamber such that the mixture of the first and second fluids is retained within the lower portion of the bottom surface while the gas bubbles within the mixture are dissipated into the chamber.

12. The method of claim 11 , wherein the substrate coating is hydrophilic.

13. The method of claim 11 , wherein the substrate coating is hydrophobic.

14. The method of claim 11 , wherein the venting channel is formed by the first and second substrate.

15. The method of claim 11 , wherein the first and second radii are in the range of about 1 mm to about 20 mm.