Semiconductor device
View Patent ↗A semiconductor device, which is constituted in such a way that a pad portion of a logic chip is connected to an element region of a semiconductor chip with a bump bonding, is capable of achieving high speed operability of the elements, because delay of transmission of an electrical signal is suppressed. a logic chip is directly connected to a DRAM, therefore, it is possible to suppress an increase of load capacitance caused by interconnects, and securing a wide bus width by a multiple pin connection. As a result, it becomes possible to enhance performance of the semiconductor device upon suppressing delay of information transmission from the logic chip to the DRAM.
1. A semiconductor device comprising:
a first semiconductor chip with a first bump located on and extending beyond a main face of said first semiconductor chip; and
a second semiconductor chip having
i) a semiconductor substrate with a substrate front surface and a substrate rear surface,
ii) a circuit having a circuit element layer and formed on the front surface of said semiconductor substrate and multi-level circuit interconnect layers provided on the front surface of said semiconductor substrate and over said circuit element layer, wherein said circuit does not have a converter circuit,
iii) a converter circuit having converter circuit element layer formed on the front surface of said semiconductor substrate, and multi-level converter interconnect layers provided on the front surface of said semiconductor substrate and over said converter circuit element layer,
iv) a plurality of through electrodes penetrating said semiconductor substrate completely from the substrate front surface to the substrate rear surface, and
v) a second bump mounted on and extending beyond a top of said multi-level circuit interconnect layers, wherein
said first semiconductor chip and said second semiconductor chip are flip-chip connected with each other via said first bump and said second bump, and
the circuit element layer and the multi-level circuit interconnect layers occupy a first area of the substrate front surface, and the converter circuit element layer and the multi-level converter interconnect layers occupy a second area of the substrate front surface,
the second area being distinct from the first area and in vertical registration with the through electrodes, and
at least one layer of the converter circuit element layer and the multi-level converter interconnect layers is connected to a corresponding multi-level circuit interconnect layer, and at least one layer of the converter circuit element layer and the multi-level converter interconnect layers is connected to a corresponding through electrode.
2. A semiconductor device comprising:
a first semiconductor chip with a first bump located on and extending beyond a main face of said first semiconductor chip; and
a second semiconductor chip having
i) a semiconductor substrate with a substrate front surface and a substrate rear surface,
ii) a circuit having a circuit element layer formed on the front surface of said semiconductor substrate and multi-level circuit interconnect layers provided on the front surface of said semiconductor substrate and over said circuit element layer, wherein said circuit does not have a buffer circuit,
iii) a buffer circuit having a buffer circuit element layer formed on the front surface of said semiconductor substrate, and multi-level buffer interconnect layers provided on the front surface of said semiconductor substrate and over said buffer circuit element layer, and
iv) a plurality of through electrodes penetrating said semiconductor substrate completely from the substrate front surface to the substrate rear surface; and
v) a second bump mounted on and extending beyond a top of said multi-level circuit interconnect layers, wherein
said first semiconductor chip and said second semiconductor chip are flip-chip connected with each other via said first bump and said second bump, and
the circuit element layer and the multi-level circuit interconnect layers occupy a first area of the substrate front surface, and the buffer circuit element layer and the multi-level buffer interconnect layers occupy a second area of the substrate front surface,
the second area being distinct from the first area and in vertical registration with the through electrodes, and
at least one layer of the buffer circuit element layer and the multi-level buffer interconnect layers is connected to a corresponding multi-level circuit interconnect layer, and at least one layer of the buffer circuit element layer and the multi-level buffer interconnect layers is connected to a corresponding through electrode.