IP Library Granted Patent US 7,479,600
Granted Patent B2
US 7,479,600 · App. 11/763,665 · Granted Jan 20, 2009

Electrical bus and method for forming an electrical bus

Assignee: Group Dekko, Inc.
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Quick Facts
Patent No.
US 7,479,600
App. No.
11/763,665
Granted
Jan 20, 2009
Kind
B2
Abstract

An electrical bus forming method including the steps of interlocking a plurality of electrical conductors and forming a shaped conductor. The interlocking step includes interlocking a plurality of electrical conductors including a first electrical conductor with a second electrical conductor thereby forming an interlocked conductor. The forming step includes forming a shaped conductor from the interlocked conductor.

Claims (22)

1. An electrical bus forming method, comprising the steps of:

interlocking a plurality of electrical conductors including a first electrical conductor with a second electrical conductor thereby forming an interlocked conductor without soldering or brazing; and

forming a shaped conductor from said interlocked conductor.

2. The method of claim 1 , wherein said forming step includes a step of stamping said interlocked conductor.

3. The method of claim 2 , wherein said stamping step includes a step of removing some material from said interlocked conductor.

4. The method of claim 3 , wherein said forming step includes a step of shaping said interlocked conductor by bending at least one portion of said interlocked conductor.

5. The method of claim 4 , wherein said forming step includes applying both said removing step and said shaping step to both said first electrical conductor and said second electrical conductor.

6. The method of claim 1 , wherein said interlocking step includes a step of displacing portions of both said first electrical conductor and said second electrical conductor in at least two substantially orthogonal directions.

7. The method of claim 6 , wherein said first electrical conductor and said second electrical conductor have an area of overlap, said displacing step being applied to said area of overlap.

8. The method of claim 7 , wherein said displacing step is carried out on at least two places in said area of overlap.

9. An electrical bus forming method, comprising the steps of:

displacing material in a plurality of electrical conductors including a first electrical conductor with a second electrical conductor thereby forming an interlocked conductor without the use of a fastener or solder; and

forming a shaped conductor from said interlocked conductor.

10. The method of claim 9 , wherein said forming step includes a step of stamping said interlocked conductor.

11. The method of claim 10 , wherein said stamping step includes a step of removing some material from said interlocked conductor.

12. The method of claim 11 , wherein said forming step includes a step of shaping said interlocked conductor by bending at least one portion of said interlocked conductor.

13. The method of claim 12 , wherein said forming step includes applying both said removing step and said shaping step to both said first electrical conductor and said second electrical conductor.

14. The method of claim 9 , wherein said displacing step includes the displacement of portions of both said first electrical conductor and said second electrical conductor in at least two substantially orthogonal directions.

15. The method of claim 14 , wherein said first electrical conductor and said second electrical conductor have an area of overlap, said displacing step being applied in a portion of said area of overlap.

16. The method of claim 15 , wherein said displacing step is carried out on at least two places in said area of overlap.

17. An electrical conductor assembly, comprising a plurality of electrical conductors including a first electrical conductor and a second electrical conductor, said first electrical conductor having a flat area positioned adjacent a flat portion of said second electrical conductor defining an area of overlap, said first electrical conductor and said second electrical conductor being interlocked to each other in said area of overlap by way of displaced portions of the materials of said first electrical conductor and said second electrical conductor, said plurality of electrical conductors being stamped after said first electrical conductor and said second electrical conductor were interlocked.

18. The electrical conductor assembly of claim 17 , wherein the materials ate displaced in at least two substantially orthogonal directions.

Assignments (3)
SECURITY AGREEMENT Recorded Jun 27, 2011
From: GROUP DEKKO, INC.
To: WELLS FARGO CAPITAL FINANCE, LLC, AS AGENT
Reel/Frame 026503/0966 →
MERGER Recorded Dec 9, 2008
From: PENT TECHNOLOGIES, INC.
To: GROUP DEKKO, INC.
Reel/Frame 021936/0719 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 27, 2007
From: SIKORA, KENNETH R.
To: PENT TECHNOLOGIES, INC.
Reel/Frame 019887/0666 →
Continuity (2)
Provisional Application 6081386100 · Jun 15, 2006
Related Publication 20080006433A1 · Jan 10, 2008