Method of generating a layout for a differential circuit
View Patent ↗A differential circuit layout can advantageously use step symmetry for inductors and mirror symmetry for the rest of the circuit. Interconnect segments can be used to connect the terminals of the inductors to other components in the circuit. These interconnect segments facilitate the transition from the step symmetry of the inductors to the mirror symmetry of the other components. To provide this transition, the terminals of an inductor and its associated interconnect segments are formed on a middle axis of the inductor. This mixed symmetry can advantageously cancel the common-mode magnetic field, reduce the parasitic inductor coupling, and balance parasitic wiring capacitances between the two sides of the differential circuit.
1. A method of generating a layout for a differential circuit, the method comprising:
positioning a pair of inductors using step symmetry, one inductor being on an opposite side of an axis of symmetry from another inductor, each inductor having a first terminal and a second terminal;
positioning a plurality of components using mirror symmetry with respect to the axis of symmetry, the plurality of components being in operative relation to the pair of inductors;
providing a first interconnect segment connecting the first terminal to a first set of the plurality of components; and
providing a second interconnect segment connecting the second terminal to a second set of the plurality of components,
wherein the first terminal, second terminal, first interconnect segment, and second interconnect segment of a first inductor of the pair of inductors is placed on a first middle axis of the first inductor,
wherein the first terminal, second terminal, first interconnect segment, and second interconnect segment of a second inductor of the pair of inductors is placed on a second middle axis of the second inductor, and
wherein the axis of symmetry, the first middle axis, and the second middle axis are parallel to each other.
2. The method of claim 1 , wherein for each inductor, the first and second interconnect segments are placed on opposite sides of the each inductor.
3. The method of claim 1 , wherein the first and second interconnect segments are placed on one side of the inductor.
4. The method of claim 1 , wherein the first interconnect segment is to be formed from a first metal layer and the second interconnect segment is to be formed from a second metal layer.