Laminate for flexible printed wiring board
View Patent ↗To provide a laminate for a flexible printed wiring board excellent in signal response in the high frequency region. A laminate for a flexible printed wiring board having a three-layer laminated structure where a reinforcing layer (A), an electrical insulator layer (B) and an electrical conductor layer (C) are laminated in this order, wherein the electrical insulator layer (B) is made of a fluorocopolymer comprising repeating units (a) based on tetrafluoroethylene and/or chlorotrifluoroethylene, repeating units (b) based on a fluoromonomer excluding tetrafluoroethylene and chlorotrifluoroethylene, and repeating units (c) based on a monomer having an acid anhydride residue and the electrical conductor layer (C) has a surface roughness of at most 10 μm on the side being in contact with the electrical insulator layer (B). The laminate for a flexible printed wiring board is excellent in signal response in the high frequency region and excellent in flex resistance.
1. A laminate for a flexible printed wiring board having a three-layer laminated structure where a reinforcing layer (A), an electrical insulator layer (B) and an electrical conductor layer (C) are laminated in this order, wherein the electrical insulator layer (B) is made of a fluorocopolymer comprising repeating units (a) based on tetrafluoroethylene and/or chlorotrifluoroethylene, repeating units (b) based on a fluoromonomer excluding tetrafluoroethylene and chlorotrifluoroethylene, and repeating units (c) based on a monomer having an acid anhydride residue and a polymerizable unsaturated bond in amounts of (a) being from 50 to 99.89 mol %, (b) being from 0.1 to 49.99 mol % and (c) being from 0.01 to 5 mol %, is based on ((a)+(b)+(c)) and the electrical conductor layer (c) has a surface roughness of at most 10 μm on the side being in contact with the electrical insulator layer (B).
2. The laminate for a flexible printed wiring board according to claim 1 , wherein the fluorocopolymer further contains repeating units (d) based on a non-fluorinated monomer excluding the monomer having an acid anhydride residue and a polymerizable unsaturated bond, and the molar ratio of ((a)+(b)+(c))/(d) is from 100/5 to 100/90.
3. The laminate for a flexible printed wiring board according to claim 1 , wherein the monomer having an acid anhydride residue and a polymerizable unsaturated bond, is at least one member selected from the group consisting of itaconic anhydride, citraconic anhydride and 5-norbornen-2,3-dicarboxylic anhydride.
4. The laminate for a flexible printed wiring board according to claim 1 , wherein the electrical conductor layer (C) is made of a metal foil of copper, silver, gold or aluminum, or a copper foil having gold plating applied thereon.
5. The laminate for a flexible printed wiring board according to claim 1 , wherein the reinforcing layer (A) is made of at least one member selected from the group consisting of a polyimide resin, a polyether ether ketone resin, a polyphenylene oxide resin, a LCP resin, an aramide fiber woven fabric, an aramide fiber non-woven fabric, an aramide paper, a glass cloth and a PTFE porous material.
6. The laminate for a flexible printed wiring board according to claim 1 , wherein the electrical conductor layer (C) has a thickness of from 1.0 to 20.0 μm.
7. The laminate for a flexible printed wiring board according to claim 1 , wherein the reinforcing layer (A) has a thickness of from 1.0 to 30.0 μm.
8. The laminate for a flexible printed wiring board according to claim 1 , wherein the electrical conductor layer (C) is made of a copper foil, and the reinforcing layer (A) is made of a polyimide resin.
9. The laminate for a flexible printed wiring board according to claim 1 , wherein said surface roughness is from 0.1 to 5 μm.