A component tape comprising a base tape that includes pockets configured to house electrical components for placement on a printed circuit board and a cover tape, covering the base tape wherein a portion of the cover tape is configured to engage with a tape engagement feature of a component tape feeder.
1. A method of preparing a component tape for engagement with a tape splitter of a feeder, the method comprising:
providing a component tape including:
a base tape, wherein the base tape includes pockets configured to house electrical components for placement on a printed circuit board; and
a cover tape, covering the base tape;
manipulating a portion of the cover tape from above the cover tape to form an upraised manipulated portion of the cover tape that continues to cover the base tape and retain the electrical components in the base tape beneath the upraised manipulated portion of the cover tape, the upraised manipulated portion of the cover tape having structure facilitating initial engagement of the cover tape with the tape splitter of the feeder, wherein the structure of the manipulated portion defined by a vacancy between a top surface of the base tape and the cover tape; and
after the manipulating the cover tape to form the upraised portion, advancing the component tape towards the tape splitter whereby the upraised manipulated portion of the cover tape contacts the tape splitter to split the cover tape from one section into two sections and expose the electrical components.
2. The method of claim 1 , wherein manipulating a portion of the cover tape includes creating a bubble in the cover tape.
3. The method of claim 1 , wherein manipulating a portion of the cover tape further includes creating a hole in the cover tape.
4. The method of claim 1 , wherein manipulating a portion of the cover tape includes heating the cover tape such that it pocks away from the base tape.
5. The method of claim 1 , wherein manipulating a portion of the cover tape includes dabbing a chemical on a small portion of cover tape causing the cover tape to warp into a raised condition away from the base tape.
6. The method of claim 1 , wherein manipulating a portion of the cover tape includes actions pertaining to the group consisting of tearing, ripping, snagging, piercing, or cutting the cover tape.
7. A method of providing a component tape to feed electronic components, said method comprising:
providing a component tape including:
a base tape, wherein the base tape includes pockets configured to house electrical components for placement on a printed circuit board; and
a cover tape, covering said base tape;
manipulating a portion of the cover tape from above the cover tape, with a pre-splitter module through operation of a pre-splitter, to form an upraised manipulated portion of the cover tape that continues to cover the base tape and retain the electrical components in the base tape beneath the upraised manipulated portion of the cover tape, the upraised manipulated portion having a structure defined by a vacancy between the cover tape and a top surface of the base tape; and
advancing the component tape towards the tape splitter whereby the upraised manipulated portion of the cover tape contacts with the tape splitter to split the cover tape from one section into two sections and expose the electrical components, as the component tape is driven through the component tape feeder.
8. The method of claim 7 , wherein manipulating the cover tape includes creating a bubble in the cover tape.
9. The method of claim 7 , wherein manipulating the cover tape further includes creating a hole in the cover tape.