Electronic component cover and arrangement

1. An electronic component cover, comprising:

a plate having a first region on one side of the plate configured to substantially cover at least one side of a first electronic component;

the plate having a second region to accommodate a second electronic component, the second region using at least part of an empty space defined by a flat plane of the plate and the first region with the second region being formed on an opposing side of the plate from the first region.

2. The electronic component cover of claim 1 , wherein the first electronic component is a modem and the second electronic component is a memory card or a memory card reader.

3. The electronic component cover of claim 1 , wherein the first electronic component or the second electronic component includes at least one of the following: (1) active circuitry, (2) passive circuitry, (3) an antenna, (4) an electrical or mechanical device, or (5) a power source.

4. The electronic component cover of claim 1 , wherein the plate forms a shield.

5. The electronic component cover of claim 1 , wherein the second region includes tabs to secure the second electronic component therein.

6. The electronic component cover of claim 5 , wherein the tabs are adapted to removably secure the second electronic component in the second region.

7. The electronic component cover of claim 1 , wherein the first region and the second region are adapted to allow an electrical coupling of the first electronic component and the second electronic component.

8. The electronic component cover of claim 1 , further comprising:

one or more tabs adapted to secure the plate to a board on which the first electronic component is adapted to be mounted.

9. The electronic component cover of claim 1 , wherein the plate is formed of tin-plated steel.

10. The electronic component cover of claim 1 , further comprising:

one or more leads adapted to provide electrical communication between the first electronic component and the second electronic component;

wherein the one or more leads are electrically isolated from the plate.

11. The electronic component cover of claim 10 , wherein the plate is formed of a polymer material and the one or more leads are etched onto the polymer material.

12. The electronic component cover of claim 10 , further comprising:

a nonconductive mount adapted to accommodate the second electronic component thereon;

wherein the nonconductive mount secures the one or more leads to the plate while electrically isolating the one or more leads from the plate.

13. The electronic component cover of claim 12 , wherein the second electronic component is an antenna embedded in the nonconductive mount.

14. The electronic component cover of claim 12 , wherein the nonconductive mount is formed of a plastic.

15. An electronic component arrangement, comprising:

a first electronic component mounted on a circuit board; and

a cover having a first region substantially covering at least one side of the first electronic component, and a second region to accommodate a second electronic component, the second region using at least part of an empty space defined by a flat plane of the plate and the first region with the second region being formed on an opposing side of the plate from the first region.

16. The electronic component arrangement of claim 15 , wherein the first electronic component is a modem and the second electronic component is a memory card or a memory card reader.

17. The electronic component arrangement of claim 15 , wherein the first electronic component or the second electronic component includes at least one of the following: (1) active circuitry, (2) passive circuitry, (3) an antenna, (4) an electrical or mechanical device, or (5) a power source.

18. The electronic component arrangement of claim 15 , wherein the cover forms a shield.

19. The electronic component arrangement of claim 15 , wherein the second region includes tabs to secure the second electronic component therein.

20. The electronic component arrangement of claim 19 , wherein the tabs are adapted to removably secure the second electronic component in the second region.

21. The electronic component arrangement of claim 15 , wherein the cover is adapted to allow electrical coupling between the first electronic component in the first region and a second electronic component in the second region.

22. The electronic component arrangement of claim 15 , wherein the cover includes one or more tabs adapted to secure the cover to the circuit board on which the first electronic component is adapted to be mounted.

23. The electronic component arrangement of claim 15 , wherein the cover is formed of tin-plated steel.

24. The electronic component arrangement of claim 15 , further comprising:

one or more leads adapted to provide electrical communication between the first electronic component and the second electronic component;

wherein the one or more leads are electrically isolated from the cover.

25. The electronic component arrangement of claim 24 , wherein the cover is formed of a polymer material and the one or more leads are etched onto the polymer material.

26. The electronic component arrangement of claim 24 , further comprising:

a nonconductive mount adapted to accommodate the second electronic component thereon;

wherein the nonconductive mount secures the one or more leads to the cover while electrically isolating the one or more leads from the cover.

27. The electronic component arrangement of claim 26 , wherein the second electronic component is an antenna embedded in the nonconductive mount.

28. The electronic component arrangement of claim 26 , wherein the nonconductive mount is formed of a plastic.

29. An electronic component arrangement, comprising:

a first electronic component mounted on a circuit board;

a cover having a first region substantially covering at least one side of the first electronic component; and

a second electronic component positioned in a second region of the cover, the second region using at least part of an empty space defined by a flat plane of the plate and the first region with the second region being formed on an opposing side of the plate from the first region.

30. The electronic component arrangement of claim 29 , wherein the first electronic component is a modem and the second electronic component is a memory card or a memory card reader.

31. The electronic component arrangement of claim 29 , wherein the first electronic component or the second electronic component includes at least one of the following: (1) active circuitry, (2) passive circuitry, (3) an antenna, (4) an electrical or mechanical device, or (5) a power source.

32. The electronic component arrangement of claim 29 , wherein the cover forms a shield.

33. The electronic component arrangement of claim 29 , wherein the second region includes tabs to secure the second electronic component therein.

34. The electronic component arrangement of claim 33 , wherein the tabs are adapted to removably secure the second electronic component in the second region.

35. The electronic component arrangement of claim 29 , wherein the cover is adapted to allow electrical coupling between the first electronic component in the first region and the second electronic component in the second region.

36. The electronic component arrangement of claim 29 , wherein the cover includes one or more tabs adapted to secure the cover to the circuit board on which the first electronic component is adapted to be mounted.

37. The electronic component arrangement of claim 29 , wherein the cover is formed of tin-plated steel.

38. The electronic component arrangement of claim 29 , wherein the second electronic component is a SIM card reader.

39. The electronic component arrangement of claim 29 , further comprising:

one or more leads adapted to provide electrical communication between the first electronic component and the second electronic component;

wherein the one or more leads are electrically isolated from the cover.

40. The electronic component arrangement of claim 39 , wherein the cover is formed of a polymer material and the one or more leads are etched onto the polymer material.

41. The electronic component arrangement of claim 39 , further comprising:

a nonconductive mount accommodating the second electronic component thereon;

wherein the nonconductive mount secures the one or more leads to the cover while electrically isolating the one or more leads from the cover.

42. The electronic component arrangement of claim 41 , wherein the second electronic component is an antenna embedded in the nonconductive mount.

43. The electronic component arrangement of claim 41 , wherein the nonconductive mount is formed of a plastic.

44. A communication device, comprising

an electronic component arrangement, the electronic component arrangement comprising:

a first electronic component mounted on a circuit board;

a cover having a first region substantially covering at least one side of the first electronic component; and

a second electronic component positioned in a second region of the cover, the second region using at least part of an empty space defined by a flat plane of the plate and the first region with the second region being formed on an opposing side of the plate from the first region.

45. The communication device of claim 44 , wherein the second electronic component is a SIM card reader.

46. The communication device of claim 44 , wherein the first electronic component or the second electronic component includes at least one of the following: (1) active circuitry, (2) passive circuitry, (3) an antenna, (4) an electrical or mechanical device, or (5) a power source.

47. The communication device of claim 44 , wherein the electronic component arrangement further comprises:

one or more leads adapted to provide electrical communication between the first electronic component and the second electronic component;

wherein the one or more leads are electrically isolated from the cover.

48. The communication device of claim 47 , wherein the electronic component arrangement further comprises:

a nonconductive mount accommodating the second electronic component thereon;

wherein the nonconductive mount secures the one or more leads to the cover while electrically isolating the one or more leads from the cover.