Semiconductor laser device
View Patent ↗A semiconductor laser device includes a supporting substrate having a wiring pattern thereon; LD fixed on the surface of the supporting substrate and having a signal output section that emits signal laser light and a monitoring output section that emits monitoring laser light; and a monitoring PD. The monitoring PD includes a semiconductor substrate having a region that transmits light of the wavelength of the monitoring laser light; and a light receiving section for photoelectric conversion formed on the surface of the semiconductor substrate, one incident surface of the side surfaces of the semiconductor substrate arranged in a position to which the monitoring laser light can be made incident, the light receiving section arranged in a position higher than the monitoring output section, and a back surface of the semiconductor substrate and the wiring pattern fixed on the supporting substrate to oppose each other.
1. A semiconductor laser device comprising:
a supporting substrate having a wiring pattern on a surface thereof;
a semiconductor laser element fixed on the surface of said supporting substrate, the semiconductor laser element having a signal output section at a first surface that emits signal laser light and a monitoring output section at a second surface that emits monitoring laser light; and
a monitoring photodiode fixed on said supporting substrate,
wherein said monitoring photodiode has a semiconductor substrate transparent to a wavelength of said monitoring laser light, and a light receiving section for photoelectric conversion on a surface of said semiconductor substrate,
said monitoring photodiode having a side surface that is an exterior incident surface of said semiconductor substrate and that is arranged at a position so that said monitoring laser light is incident thereon, said light receiving section is arranged at a position higher than said monitoring output section, and a back surface of said semiconductor substrate opposite said exterior incident surface is arranged to oppose said wiring pattern,
the surface of said supporting substrate is substantially a flat plane, and said semiconductor laser element and said monitoring photodiode are arranged on said flat plane with both the second surface and the exterior incident surface extending in a perpendicular direction from the flat plane, and
the second surface and the exterior incident surface are arranged to be non-parallel with respect to each other.
2. A semiconductor laser device according to claim 1 , wherein said semiconductor laser element and said light receiving section of said monitoring photodiode are electrically connected respectively to said wiring pattern via wires.
3. A semiconductor laser device according to claim 1 , wherein a distance between said monitoring output section of said semiconductor laser element and said exterior incident surface of said monitoring photodiode is set so that a light reception amount of said monitoring photodiode is a maximum value.
4. A semiconductor laser device according to claim 1 , wherein on the back surface of said semiconductor substrate there is an electrode that reflects, into said semiconductor substrate, said monitoring laser light that is incident into said semiconductor substrate at said exterior incident surface.
5. A semiconductor laser device according to claim 1 , wherein on the back surface on a side opposite to the exterior incident surface of said semiconductor substrate there is a reflection film that reflects, into said semiconductor substrate, said monitoring laser light that is incident into the semiconductor substrate from said exterior incident surface.
6. A semiconductor laser device according to claim 1 , wherein on said exterior incident surface of said semiconductor substrate there is an anti-reflection film that prevents reflection of said monitoring laser light that is incident on said exterior incident surface.
7. A semiconductor laser device according to claim 1 , wherein on both side surfaces substantially orthogonal to said exterior incident surface of said semiconductor substrate there are reflection films that reflect, into said semiconductor substrate, said monitoring laser light that is incident into said semiconductor substrate from said exterior incident surface.
8. A semiconductor laser device according to claim 1 , wherein on the light receiving section of said monitoring photodiode there is a reflection film that reflects, into said light receiving section, said monitoring laser light that is incident on said semiconductor substrate and transmitted through said light receiving section.
9. A semiconductor laser device according to claim 1 , wherein said monitoring photodiode has a surface incident type structure.
10. A semiconductor laser device according to claim 5 , wherein said reflection film is either a metallic film or a dielectric reflection film.
11. A semiconductor laser device according to claim 6 , wherein said anti-reflection film is a silicon nitride film.
12. A semiconductor laser device according to claim 1 , wherein said semiconductor substrate is an indium-phosphorous substrate.
13. A semiconductor laser device according to claim 1 , wherein an angle of inclination θ of the exterior incident surface with respect to the second surface is 0°<θ<180°.
14. A semiconductor laser device according to claim 1 , wherein an angle of inclination θ of the exterior incident surface with respect to the second surface is 0°<θ<90°.