Method for manufacturing semiconductor device, semiconductor device, and electrooptical device
View Patent ↗A method for manufacturing a semiconductor device which is equipped with a switching element having an organic semiconductor layer and a drive circuit electrically coupled to the switching element on a first surface of a flexible substrate, the method including: providing the drive circuit above a temporary substrate in advance, transferring the drive circuit to the first surface of the flexible substrate, and then providing the organic semiconductor layer by a liquid phase process.
1. A method for manufacturing a semiconductor device which is equipped with a switching element having an organic semiconductor layer and a drive circuit electrically coupled to the switching element on a first surface of a flexible substrate, the method comprising:
providing the drive circuit above a temporary substrate;
transferring the drive circuit to the first surface of the flexible substrate; and
providing the organic semiconductor layer by a liquid phase process after transferring the drive circuit to the first surface of the flexible substrate.
2. The method for manufacturing a semiconductor device according to claim 1 , further comprising:
attaching a support substrate to a second surface of the flexible substrate before transferring the drive circuit to the first surface of the flexible substrate.
3. The method for manufacturing a semiconductor device according to claim 1 , the liquid phase process being a droplet discharge method.
4. A semiconductor device manufactured by the manufacturing method of claim 1 .
5. An electrooptical device equipped with the semiconductor device of claim 4 .