Spray deposited heater element
View Patent ↗A heater that may be applied to a substrate. The heater may include a graduating material deposited on at least a portion of a substrate, a resistive material and a thermal barrier dielectric coating. The resistive material may include at least two resistive compositions, wherein the resistivity of the material may be altered by varying the composition in given areas.
1. A method of forming a heater comprising:
depositing a graduating material on at least a portion of a substrate;
depositing a resistive material over at least a portion of said substrate, wherein the resistive material includes a mixture of a first resistive composition and a second resistive composition, wherein said first resistive composition has a first resistivity of ρ 1 and said second resistive composition has a resistivity of ρ 2 , wherein ρ 1 ≠ρ 2 ; and
depositing a thermal barrier dielectric material over at least a portion of said substrate; and
mixing said first resistive composition and said second resistive composition prior to depositing said first resistive composition and said second resistive composition over at least a portion of said substrate.
2. The method of claim 1 , wherein said first resistive composition and said second resistive composition may be deposited by thermal spraying.
3. The method of claim 1 , further comprising preparing a surface of said substrate.
4. The method of claim 1 , wherein depositing said resistive material further comprises varying the weight percentage of said first resistive composition and said second resistive composition over at least a portion of said substrate.
5. The method of claim 1 , further comprising mixing said first resistive composition and said second resistive composition prior to spraying said first resistive composition and said second resistive composition over at least a portion of said substrate.
6. The method of claim 1 , further comprising mixing said first resistive composition and said second resistive composition after spraying said first resistive composition and said second resistive composition onto said substrate.
7. The method of claim 1 , wherein said first resistive composition and said second resistive composition include substantially the same base material, and said resistivity of said first resistive composition and said second resistive composition are altered by depositing said first resistive composition with a first gas and said second resistive composition with a second gas.
8. The method of claim 1 , wherein said first resistive composition and said second resistive composition may be deposited by electron beam.
9. The method of claim 1 , further comprising preparing a surface of said substrate.
10. The method of claim 1 , wherein depositing said resistive material further comprises varying the weight percentage of said first resistive composition and said second resistive composition over at least a portion of said substrate.