IP Library Granted Patent US 7,675,286
Granted Patent B2
US 7,675,286 · App. 11/778,336 · Granted Mar 9, 2010

Magnetoresistive sensor device

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Quick Facts
Patent No.
US 7,675,286
App. No.
11/778,336
Granted
Mar 9, 2010
Kind
B2
Abstract

According to the present invention, a magnetoresistive sensor device, which can be manufactured at a high yield and a low cost, is excellent in magnetoresistance characteristics and is reliable can be provided. The magnetoresistive sensor device comprises a substrate, a signal processing circuit formed on the substrate, a flattening film for flattening the signal processing circuit, a silicon nitride film formed on the flattened signal processing circuit, and magnetoresistive sensor elements formed on the silicone nitride film, in which the flattening film is preferably a spin-on-glass (SOG) film.

Claims (10)

1. An on-vehicle magnetoresistive sensor device, comprising:

a substrate;

a signal processing circuit formed on the substrate;

a flattening film for flattening the signal processing circuit;

a silicon nitride film formed on the flattened signal processing circuit;

magnetoresistive sensor elements formed on the silicone nitride film; and

a protective layer consisting of a silicon nitride film formed on the magnetoresistive sensor elements,

wherein a film stress of the silicon nitride film formed on the flattened signal processing circuit and a film stress of the silicon nitride film formed on the magnetoresistive sensor elements is between −1.0×10 8 N/m 2 and 1.0×10 8 N/m 2 .

2. The on-vehicle magnetoresistive sensor device according to claim 1 , wherein the flattening film is a spin-on-glass (SOG) film.

3. The on-vehicle magnetoresistive sensor device according to claim 1 , wherein the signal processing circuit includes a circuit portion formed on the substrate, an interlayer insulating layer formed on the circuit portion, a first wiring formed on the interlayer insulating layer and a protective film formed on the interlayer insulating layer and the first wiring.

Assignments (2)
COMPANY SPLIT Recorded Sep 4, 2024
From: MITSUBISHI ELECTRIC CORPORATION
To: MITSUBISHI ELECTRIC MOBILITY CORPORATION
Reel/Frame 068834/0585 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 16, 2007
From: HOSOMI, SHINICHI; MATSUI, HIROBUMI; SAKAI, YUICHI
To: MITSUBISHI ELECTRIC CORPORATION
Reel/Frame 019561/0413 →