Hybrid antenna structure
View Patent ↗An electrical component is provided that provides at least a two shot injection molding structure. One of the at least two shots of plastic comprises a laser direct structuring material. Another of the at least two shots of plastic comprises a non-platable plastic. The laser direct structuring material is selectively activated such that a conductive trace can be plated on the laser direct structuring material.
1. A method of forming an electrical component comprising the steps of:
injecting a first shot of a first type of plastic to obtain a first structural component;
injecting a second shot of a second type of plastic to couple the first type of plastic to the second type of plastic, the coupling of the first type of plastic and the second type of plastic forming a second structural component wherein one of the first type of plastic or the second type of plastic comprises a laser direct structuring material and the other one of the first type of plastic or the second type of plastic comprises a non-platable plastic;
painting the laser direct structuring material with a laser to activate a portion of the laser direct structuring material; and
plating the activated portion of the laser direct structuring material such that a conductive trace resides on the activated portion of the laser direct structuring material.
2. The method according to claim 1 , wherein the first type of plastic comprises the laser direct structuring material, and the second type of plastic comprises a non-platable plastic.
3. The method according to claim 1 , wherein the non-platable plastic forms an un-plated base section of the electrical component.
4. The method according to claim 1 , wherein the method includes:
injecting the first shot of the first type of plastic into a first mold to obtain the first structural component;
transferring the first structural component to a second mold; and
injecting the second shot of the second type of plastic into the second mold to couple the first type of plastic to the second type of plastic.
5. The method according to claim 4 , further comprising the steps of:
transferring the second structural component to a third mold; and
injecting a third shot of a third type of plastic to the couple the third type of plastic to at least one of the first type of plastic or the second type of plastic,
wherein the third type of plastic comprises a platable plastic and wherein the method includes plating the platable plastic such that the conductive trace resides on the platable plastic and the activated portion of the laser direct structuring material.
6. The method according to claim 1 , wherein no platable plastic is used.
7. The method according to claim 6 , further comprising the steps of:
transferring the second structural component to a third mold; and
injecting a shot of platable plastic into the third mold to the couple the platable plastic to at least one of the laser direct structuring material or the non-platable plastic,
wherein the method includes plating the platable plastic such that the conductive trace resides on the platable plastic and the activated portion of the laser direct structuring material.
8. The method according to claim 1 , wherein the method includes:
selectively painting the laser direct structuring material; and
selectively plating the activated portion of the laser direct structuring material such that the conductive trace has a meandering configuration.
9. The method according to claim 1 , wherein the method includes:
activating alternative portions of the laser direct structuring material; and
plating the activated alternative portions of the laser direct structuring material, to thereby provide a conductive trace with a different configuration that resides on the activated alternative portions of the laser direct structuring material.
10. The method according to claim 9 , wherein activating alternative portions includes reprogramming the laser such that the conductive trace with the different configuration may be provided without having to use a differently configured mold.
11. A method of forming an electrical component comprising the steps of:
injecting a shot of laser direct structuring material to obtain a first structural component;
injecting a shot of non-platable plastic to couple with the laser direct structuring material to form a second structural component;
painting the laser direct structuring material with a laser to activate a portion of the laser direct structuring material; and
plating the activated portion of the laser direct structuring material such that a conductive trace resides on the activated portion of the laser direct structuring material.
12. The method according to claim 11 , wherein the method includes:
injecting the shot of laser direct structuring material into a first mold to obtain the first structural component;
transferring the first structural component to a second mold; and
injecting the shot of non-platable plastic into the second mold to couple with the laser direct structuring material to form the second structural component.
13. An electrical component comprising:
a first conductive trace carrying section comprising a laser direct structuring material having an activated portion and a non-activated portion;
a base section, the base section coupled to the first conductive trace carrying section and comprising a non-platable plastic; and
a conductive trace plated to the activated portion of the first conductive trace carrying section.
14. The electrical component according to claim 13 , wherein the activated portion comprises a non-contiguous plurality of activated portions.
15. The electrical component according to claim 13 , wherein the base section comprises polycarbon.
16. The electrical component according to claim 13 , wherein the base section comprises at least one prong to couple the base section to a mounting surface.
17. The electrical component according to claim 16 , wherein each of the at least one prongs comprise a shaft portion and a protrusion portion.
18. The electrical component according to claim 16 , wherein each of the at least one prongs comprises a shaft portion and a snap portion.
19. The electrical component according to claim 13 , further comprising a second conductive trace carrying section comprising a platable plastic and the conductive trace is plated to the platable plastic.
20. The electrical component according to claim 13 , wherein the electrical component comprises an antenna.
21. An apparatus comprising:
an electrical component; and
a mounting surface coupled to the electrical component,
the electrical component comprising:
a first conductive trace carrying section comprising a laser direct structuring material having an activated portion and a non-activated portion,
a base section, the base section coupled to the first conductive trace carrying section and comprising a non-platable plastic, and
a conductive trace plated to the activated portion of the first conductive trace carrying section.
22. The apparatus according to claim 21 , wherein the electrical component further comprises a second conductive trace carrying section comprising a platable plastic and the conductive trace is plated to the platable plastic.
23. The apparatus according to claim 21 , wherein the base section comprises at least one prong having a shaft and a protrusion to couple a detent having a lip in the mounting surface.
24. The apparatus according to claim 21 , wherein the mounting surface comprises a sidewall having a lip and the at least one prong comprises a shaft and a protrusion where the protrusion couples to the lip.
25. The apparatus according to 24 , wherein the sidewall comprises a recess into which the protrusion extends.
26. The apparatus according to claim 21 , wherein the apparatus comprises a wireless device and the electrical component comprises an antenna.